The invention discloses a method for
processing a right-angle shape on an
integrated circuit support plate and the
integrated circuit support plate, and the method comprises the steps: carrying out the
exposure of an anti-
corrosion photosensitive dry film covering a
processing copper layer of a working plate according to the
exposure data, and enabling the
exposure data to comprise the
exposure data of an outer-layer circuit pattern and a concave groove pattern, the concave groove pattern
exposure data comprises a concave groove target pattern subjected to
etching compensation, and the
etching compensation method comprises the following steps of: performing
line width compensation on the inner wall and the notch end surface of a preset concave groove pattern to obtain a middle
design pattern; performing arc-shaped addition compensation on the notch and the inner wall of the groove bottom of the middle
design pattern, and performing arc-shaped subtraction compensation on the position, close to the inner wall of the groove bottom, on the inner side wall of the middle
design pattern to obtain a concave groove target pattern; and an outer layer circuit and a concave groove are obtained after developing,
etching and film stripping, and the angle of the corner of the concave groove is more than 89 degrees. According to the method, the problem of excessive internal
corrosion caused by fluid retention is solved, and the
cutting precision during carrier plate
cutting is improved.