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Mems sensor structure based on lead frame

A lead frame and sensor technology, applied in the field of lead frame-based MEMS sensor structure, can solve problems such as sensitivity signal interference and limitation

Active Publication Date: 2019-06-07
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sensitivity of these transducing systems is often limited by the level of signal interference in the form of electrical noise from various sources

Method used

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  • Mems sensor structure based on lead frame
  • Mems sensor structure based on lead frame
  • Mems sensor structure based on lead frame

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Embodiment Construction

[0015] The following detailed description refers to the accompanying drawings, which show by way of illustration specific details and embodiments in which the disclosure may be practiced.

[0016] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments or designs.

[0017] The word "over" used in reference to deposited material formed "on a side or surface" may be used herein to mean that the deposited material may be formed "directly on the implied side or surface" , such as in direct contact with the implied side or surface. The word "over" used in reference to a deposited material formed "on a side or surface" may be used herein to mean that a deposited material may be formed "indirectly on an implied side or surface" , wherein one or more additional layers are arranged between the implied s...

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PUM

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Abstract

The present invention relates to lead frame based MEMS sensor structures. A sensor structure is disclosed. The sensor structure may include: a lead frame for supporting the MEMS sensor; a recess in a surface of the lead frame; and a MEMS sensor coupled to the surface of the lead frame and disposed over the recess to form a cavity. Alternatively, the lead frame may have a perforation formed therethrough and the MEMS sensor may be coupled to the surface of the lead frame and disposed over the opening of the perforation.

Description

technical field [0001] Various embodiments generally relate to leadframe-based sensor structures that may include diaphragm elements. Background technique [0002] Many conventional transducers convert diaphragm deflection into a voltage proportional to the magnitude of the diaphragm deflection. The sensitivity of these transducing systems is often limited by the level of signal interference in the form of electrical noise from various sources. In conventional condenser microphones, few sources of signal interference such as signal interference can include one or more of the following: the size of the sound inlet opening in the microphone housing; air flow across the capacitor gap; the impedance of the transducer circuitry ; and the size of the back volume of the microphone. Contents of the invention [0003] In various embodiments, a microelectromechanical system (MEMS) sensor structure is disclosed. The MEMS sensor structure may include: a lead frame for supporting th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/043B81B7/02
CPCH01L2924/181H01L2224/05554H01L2224/48091H01L2224/48137H01L2224/48257H01L2224/49109H01L2224/73265B81C1/0023B81B2201/0257H04R19/005H01L2924/00012H01L2924/00014G01L9/0042H01L2924/1461H10N30/204H10N30/1071H10N30/2047B81B7/007
Inventor C.加雷马尼D.科尔U.辛德勒H.托伊斯
Owner INFINEON TECH AG