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Apparatus and method for attaching an adhesive film to a semiconductor substrate

A semiconductor and substrate technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problem of high risk of device surface damage

Active Publication Date: 2019-02-01
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, as semiconductor substrates become thinner, the risk of damage to the device surface is higher

Method used

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  • Apparatus and method for attaching an adhesive film to a semiconductor substrate
  • Apparatus and method for attaching an adhesive film to a semiconductor substrate
  • Apparatus and method for attaching an adhesive film to a semiconductor substrate

Examples

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Embodiment Construction

[0016] refer to Figures 1A-1B , discloses an embodiment of the device of the present invention for automatically pasting an adhesive film on a semiconductor substrate. The apparatus includes a Bernoulli arm 1010 , a table 1022 , a gas nozzle 1002 , a rotating disk 1001 , a linear drive 1004 and a rotary drive 1005 . The Bernoulli arm 1010 supports a thin semiconductor substrate 1000 without contacting the semiconductor substrate 1000 . The workbench 1022 loads and positions the adhesive film 1020 so that the adhesive film 1020 is located above the semiconductor substrate 1000 . The gas nozzle 1002 provides film sticking gas to the adhesive film 1020 . The rotating disc 1001 is mounted on a linear drive 1004 for guiding the movement of the gas nozzle 1002 . The rotary driver 1005 drives the rotary disk 1001 to rotate.

[0017] The Bernoulli arm 1010 is used as a supporting arm to hold the thin semiconductor substrate 1000 and make the semiconductor substrate 1000 in a suspe...

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PUM

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Abstract

The present invention discloses an apparatus and a method for taping adhesive film on semiconductor substrate. In one embodiment, the apparatus includes: a support arm holding a semiconductor substrate; a stage loading and locating an adhesive film above the semiconductor substrate; a rotating plate having a linear rail and being positioned over the adhesive film; a linear actuator mounted on the linear rail and being capable of moving along the linear rail; a gas nozzle supplying taping gas onto the adhesive film for pressing the adhesive film onto the adhesive side of the semiconductor substrate, the gas nozzle fixed on the linear actuator and moving together with the linear actuator; and a rotating actuator connected to the rotating plate and driving the rotating plate to rotate in a plane parallel to the plane of the semiconductor substrate.

Description

technical field [0001] The invention relates to a device and a method for pasting an adhesive film on a semiconductor substrate. More specifically, the present invention relates to the use of support arms to hold a semiconductor substrate and movable nozzles to provide film deposition gas to automatically apply adhesive films on a semiconductor substrate according to a programmable trajectory. Background technique [0002] During the manufacturing process of semiconductor devices, for different purposes, such as dicing, chip dicing, and cleaning, an adhesive film is attached to the semiconductor substrate to protect or support the semiconductor substrate. In the existing film attaching process, when a film is attached to the back of the semiconductor substrate, the device surface of the semiconductor substrate needs to be fixed by vacuum adsorption. In this case, the device surface of the semiconductor substrate will be in contact with the surface of the vacuum chuck, and w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/67
CPCH01L21/67132
Inventor 王晖王希赵虎王俊
Owner ACM RES SHANGHAI