Three-dimension symmetrical vertical transformer

A transformer and symmetrical line technology, applied in the field of transformers, can solve the problems of SiP technology operation speed, power consumption and size bottlenecks, and achieve the effect of saving chip area

Active Publication Date: 2016-02-03
IND TECH RES INST
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, when packaging requirements become more complex, SiP technology also en

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  • Three-dimension symmetrical vertical transformer
  • Three-dimension symmetrical vertical transformer
  • Three-dimension symmetrical vertical transformer

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Embodiment Construction

[0094] As used throughout the present specification (including claims), the term "coupled" may refer to any connection means, direct or indirect. For example, if it is described that a first device is coupled to a second device, it should be interpreted as that the first device can be directly connected to the second device, or that the first device can be connected through other devices or some kind of connection means. and indirectly connected to the second device. In addition, wherever possible, components / members / steps using the same reference numerals in the drawings and embodiments represent the same or similar parts. Components / components / steps using the same symbols or using the same terms in different embodiments can refer to related descriptions.

[0095] figure 1 It is a schematic circuit diagram illustrating a transformer 100 according to an embodiment of the present invention. The transformer 100 includes a primary coil (primary coil) 110 and a secondary coil (...

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Abstract

First and second paths of the primary-coil of the transformer are located at different sides of the symmetry-line. First terminals of the first and second paths are first and second ports of the primary-coil. Second terminals of the first and second paths are connected to each other. Two partial paths of the first path are connected to each other by TSV. Two partial paths of the second path are connected to each other by TSV. Third and fourth paths of the secondary-coil of the transformer are located on different sides of the symmetry-line. First terminals of the third and fourth paths are first and second ports of the secondary-coil. Second terminals of the third and fourth paths are connected to each other. Two partial paths of the third path are connected to each other by TSV. Two partial paths of the fourth path are connected to each other by TSV.

Description

technical field [0001] The present invention relates to a transformer, and in particular to a three-dimensional symmetrical vertical transformer. Background technique [0002] The integrated circuit technology can implement various passive components (Integrated passive device, IPD) in the chip by using the front-end technology. The inductor and transformer in the chip are common passive components, and have been widely used in various radio frequency integrated circuits, such as low noise amplifier (low noise amplifier, LNA), voltage-controlled oscillator (voltage-controlled oscillator, VCO), injection-locked Frequency divider (injection-lockedfrequencydivider, ILFD), and power amplifier (poweramplifier, PA), etc. Although implementing inductors and transformers on-chip can reduce the number of external components, the passive components in these chips often occupy a large amount of chip area, resulting in increased cost in expensive front-end processes. [0003] The deve...

Claims

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Application Information

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IPC IPC(8): H01L23/522
CPCH01F27/2804H01F2027/2809H01L2924/0002H01L2924/00
Inventor 李思翰林志昇
Owner IND TECH RES INST
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