Low emissivity electrostatic chuck and ion implantation system having same
An electrostatic chuck and ion implantation technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as extra loss, coatings that cannot be equipped with electrostatic chucks, and power loss.
Active Publication Date: 2018-04-20
VARIAN SEMICON EQUIP ASSOC INC
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- Application Information
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Problems solved by technology
For example, an electrostatic chuck that is typically heated to 500°C may lose power on the order of a kilowatt through the clamping face of the electrostatic chuck, an additional 150 watts may be lost through the outside edge, and additional power may be lost through the rear surface of the electrostatic chuck that is equipped with radiation shielding. 150 watts
While low emissivity coatings are effective in reducing emissions from the various surfaces of the electrostatic chuck, such low emissivity coatings are metallic and therefore conductors of charge
Therefore, such coatings cannot be deployed on the front surface of an electrostatic chuck because an insulating layer is required on the front surface of the electrostatic clamp to generate the clamping electrostatic field
Therefore, the high power loss caused by radiation from the front surface of the electrostatic chuck remains a challenge
Method used
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[0015] Embodiments of the invention will be described more fully hereinafter with reference to the accompanying drawings, in which various embodiments are shown. Embodiments of the invention may, however, be embodied in many different forms and therefore should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to complete the disclosure of the present invention and to fully convey the concept of the present invention to any person having common knowledge in the technical field to which the present invention pertains. Like reference numerals refer to like elements throughout the drawings.
[0016] Embodiments relate to apparatus and systems for processing workpieces or substrates at high temperatures. As used herein, the term "high temperature" generally refers to a substrate temperature greater than about 50°C. Embodiments are particularly useful for processing substrates at temperatures in excess of about 200°C. This em...
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Abstract
The invention provides a low emissivity electrostatic chuck and its ion implantation system. The electrostatic chuck includes a heater and electrodes arranged on the heater. The electrostatic chuck also includes an insulator layer and a coating disposed on the insulator, wherein the coating is used to support the electrostatic field generated by the electrode system to attract the substrate.
Description
technical field [0001] The present invention relates to substrate processing. In particular, the present invention relates to an improved electrostatic chuck (ESC) for substrate processing and an ion implantation system having the same. Background technique [0002] Modern substrate processing for applications such as semiconductor component fabrication, solar cell fabrication, electronic component fabrication, sensor fabrication, and microelectromechanical component fabrication often requires a device ("tool") that uses an electrostatic holder or "chuck" to to hold the substrate. Examples of such devices include chemical vapor deposition (chemical vapor deposition, CVD) tools, physical vapor deposition (physical vapor deposition, PVD) tools, substrate etching tools such as reactive ion etching (reactive ion etching, RIE) equipment, ion implantation into the system and other devices. In these devices, preferably, the substrate can be heated to a high temperature. [0003...
Claims
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IPC IPC(8): H01L21/687H01L21/324
CPCH01L21/6831
Inventor 朱利安·G·布雷克岱尔·K·史东留德米拉·史东麦可·斯库拉么尔
Owner VARIAN SEMICON EQUIP ASSOC INC