Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer device and method for processing wafers

A technology of wafers and support rings, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of easy warping of thin wafers, difficulty in processing thin wafers, cracking, etc.

Active Publication Date: 2018-11-06
INFINEON TECH AG
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Handling and / or processing thin wafers is very difficult due to their e.g. tendency to warp and / or crack

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer device and method for processing wafers
  • Wafer device and method for processing wafers
  • Wafer device and method for processing wafers

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0013] The detailed description follows with reference to the accompanying drawings, which show by way of illustration specific details and embodiments for practicing the invention. These embodiments will be described in detail to enable those skilled in the art to practice the invention. Other embodiments may be utilized and structural, logical, and electrical changes may be made without departing from the scope of the present invention. The different embodiments are not necessarily mutually exclusive, as some embodiments can be combined with one or more embodiments to form new embodiments. Various embodiments will be described in connection with methods and devices. However, it is to be understood that embodiments described in connection with methods are equally applicable to devices and vice versa.

[0014] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment or design described herein as "exemplary" is not to be ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present application relates to wafer devices and methods of processing wafers. According to various embodiments, a wafer arrangement may comprise a wafer and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attachable to each other.

Description

technical field [0001] Various embodiments relate to wafer devices and methods of processing wafers. Background technique [0002] Semiconductor chips are usually made from semiconductor wafers. Handling and / or processing thin wafers is very difficult since thin wafers are prone to warping and / or cracking, for example. In order to safely handle and / or process the wafer, it may be desirable to increase the mechanical stability of the wafer. Contents of the invention [0003] According to various embodiments, a wafer arrangement may comprise a wafer and a wafer support ring, wherein the wafer and the wafer support ring are configured to be releasably attached to each other. Description of drawings [0004] In the drawings, like reference numbers generally refer to the same parts in the different views. The drawings are not necessarily to scale, emphasis generally being placed upon illustrating the principles of the invention. In the following specification, different e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/687
CPCH01L21/68721H01L21/304H01L21/6835H01L2221/68318H01L2221/6834H01L2221/68381H01L21/67369
Inventor F·J·桑托斯罗德里奎兹G·拉克纳J·昂特韦格
Owner INFINEON TECH AG