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Open heat dissipation lamps

An open-type, lamp technology, applied in lighting and heating equipment, cooling/heating devices for lighting devices, semiconductor devices for light-emitting elements, etc. Slow speed and other problems, to achieve good heat dissipation performance

Active Publication Date: 2018-05-08
东莞市闻誉实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lighting device adopting the above-mentioned structure for heat dissipation has low heat conduction efficiency and slow heat dissipation speed, which makes the lighting device prone to safety hazards due to poor heat dissipation and excessive heat load of the internal circuit mechanism

Method used

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  • Open heat dissipation lamps
  • Open heat dissipation lamps
  • Open heat dissipation lamps

Examples

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Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also exist. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative pur...

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PUM

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Abstract

An opening type heat radiation lamp comprises a base, a circuit mechanism, a supporting frame, a lampshade, a heat radiation pipe and an LED module. The base comprises a bottom plate and an installation cover which is arranged on the bottom plate in a covering mode. The supporting frame is installed on the installation cover. A first end of the lampshade is connected with the supporting frame. A second end of the lampshade is provided with a heat radiation opening. A first end of the heat radiation pipe is fixed to the first end of the lampshade, the heat radiation pipe is hollow, and a second end of the heat radiation pipe communicates with the outside. A bladeless fan is arranged on the outer side wall of the first end of the heat radiation pipe in a sleeving mode, and an annular air outlet of the bladeless fan faces the heat radiation opening. The LED module comprises a plurality of LED sub-light-sources which are arranged on the outer side wall of the heat radiation pipe. A heat radiation cavity communicating with the outside is formed in the heat radiation pipe of the opening type heat radiation lamp, and the lampshade is provided with the heat radiation opening, so that the heat generated by the multiple LED sub-light-sources is dissipated to the outside more rapidly in time, and the heat radiation performance is good.

Description

Technical field [0001] The invention relates to the technical field of lighting and heat dissipation, in particular to an open-type heat dissipation lamp. Background technique [0002] At present, in existing lighting devices, the main heating elements are generally PCB aluminum substrates that directly contact the light source, and a circuit board that drives the light source to emit light. In order to integrate the lighting device, the PCB aluminum substrate and the circuit board are usually placed inside the lighting device. [0003] Generally, PCB aluminum substrates and circuit boards generally transfer heat to the air through the housing. The lighting device adopting the above structure to dissipate heat has low heat conduction efficiency and slow heat dissipation speed, so that the lighting device is prone to a safety hazard of excessive heat load of the internal circuit mechanism due to poor heat dissipation. Summary of the invention [0004] Based on this, it is necessary...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S9/03F21V29/503F21V23/00F21V29/83F21V29/506F21V29/70F21V29/67F21V21/108F21Y115/10F21Y107/30
CPCF21S6/002F21S9/03F21V21/108F21V23/003F21V29/503F21V29/506F21V29/67F21V29/70F21V29/83
Inventor 叶伟炳
Owner 东莞市闻誉实业有限公司
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