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A packaging structure and packaging method for an injectable neurostimulator

A technology of nerve stimulation and encapsulation method, which is applied in the directions of sealed shell, physical therapy, artificial respiration, etc., can solve the problems of complex manufacturing process, small internal volume, long time consumption, etc., and achieve the effect of simple manufacturing process, small volume and low cost

Active Publication Date: 2019-02-12
HANGZHOU CHENGNUO MEDICAL SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the prior art, fully hermetic packages of injectable or implantable neuromuscular stimulators, known as organisms, are very complex to manufacture and require expensive equipment such as lasers
The electronic circuitry inside the stimulator must be connected by sealed wires to the electrodes that touch the outer surface of the stimulated tissue, the mechanical stress of such wires can cause catastrophic failure
The internal volume of this neurostimulator is very small, so even if there is a leak, it is less likely to be detected during the manufacturing and testing process, which takes a long time. A leak on the packaging can cause moisture to condense within a few days after implantation. around the circuit boards of neurostimulators, and there are currently no commercially available technologies that can detect leaks during manufacturing and testing

Method used

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  • A packaging structure and packaging method for an injectable neurostimulator
  • A packaging structure and packaging method for an injectable neurostimulator
  • A packaging structure and packaging method for an injectable neurostimulator

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Embodiment Construction

[0032] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] The invention discloses a package structure of an injectable nerve stimulator. For the structure of the cross section, see figure 1 , electronic circuits are arranged on the circuit board 10, carrying various surface mount components 12 that constitute the neurostimulator 20; The shape of a cylinder is wrapped around 20-30 turns by the antenna coil 1, and one end of the antenna coil 1 is welded together with the solder joint 23 on the circuit board 10; Each electrode is soldered to the solder joint 23 of the circuit board 10 through a lead wire 4, so as to realize the electrical connection relationship between the electrodes 3, 5 and the circuit board 10, and the lead wire 4 passes through the hollow of the ferrite 2; nerve stimulation The interior surrounded by the shell 27 of the device 20 is filled with a sealant 25, the sealant ...

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Abstract

The invention discloses a packaging structure and method of an injectable nerve stimulator. The packaging structure comprises an antenna coil, a ferrite, an anode electrode, a cathode electrode, leads, a circuit board, surface mounted components, soldering tin, a sealant and a casing. According to the invention, packaging in a non-sealing manner is realized via the vacuum effect, the internal of the nerve stimulator can be all protected by the sealant , and irreversible damage on the electrical connection relation caused by that water or steam is condensed on the internal circuit board is prevented effectively; and the packaging structure is small in size, manufacture technology of the packaging structure is simple due to the fact that an injection manner can be used for implantation, the cost is lower, and the structure and method are suitable for packaging of different times of nerve stimulators.

Description

technical field [0001] The invention belongs to the field of nerve stimulation, in particular to a packaging structure and a packaging method of an injectable nerve stimulator. Background technique [0002] Most features of epoxy-encapsulated implanted electronics were relatively well studied during the period 1950-1980 before titanium and ceramics were used as containers or leads to hermetically encapsulate implanted electronics, such as An implantable neuromuscular stimulator based on epoxy resin encapsulation. Epoxy resin encapsulation is usually applied to relatively large surgical implants that need to be waterproofed with a thicker layer of epoxy resin. Recently, a minimally invasive cardiac pacemaker that can be used in utero has been developed, including a Glass enclosures and other water-impermeable components, such as titanium battery cases and ceramic ferrites, limit the exposed surface area of ​​the epoxy encapsulation and seal the electronic circuits with epoxy...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/06A61N1/36
Inventor 史思思焦龙鹏吉拉德·勒布
Owner HANGZHOU CHENGNUO MEDICAL SCI & TECH CO LTD
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