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Packaging structure and packaging method of multifunctional integrated circuit

An integrated circuit and packaging structure technology, applied in the field of packaging structure of multifunctional integrated circuits, can solve the problems of consuming multi-frame area and space, unable to meet the needs of consumers for the appearance of portable electronic devices, etc.

Active Publication Date: 2019-05-21
RAYDIUM SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the development trend of narrow bezels of portable electronic devices such as modern smartphones, the above-mentioned traditional packaging structure consumes too much frame area and space, and can no longer meet consumers' needs for the appearance of portable electronic devices.

Method used

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  • Packaging structure and packaging method of multifunctional integrated circuit
  • Packaging structure and packaging method of multifunctional integrated circuit
  • Packaging structure and packaging method of multifunctional integrated circuit

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Experimental program
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Embodiment Construction

[0054] A preferred embodiment according to the present invention is a packaging structure of a multifunctional integrated circuit. In this embodiment, the packaging structure of the multifunctional integrated circuit can be applied to various types of portable electronic devices, such as smart phones, tablet computers, personal digital assistants (PDAs), notebook computers, etc., so as to further save The frame area on the display panel of the portable electronic device still provides all the original functions, so it can meet the current consumer's preference for a portable electronic device with a narrow frame, but not limited thereto.

[0055] Please refer to image 3 , image 3 It is a schematic diagram of a packaging structure of a multifunctional integrated circuit according to a preferred embodiment of the present invention.

[0056] Such as image 3 As shown, the packaging structure 3 of the multifunctional integrated circuit at least includes a multifunctional inte...

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Abstract

A multi-function IC packaging structure and method are disclosed. The multi-function IC packaging structure includes a substrate, a multi-function IC, a packaging material, solder joints, and a circuit board. Pads are disposed on the substrate. Bumps are disposed on the multi-function IC. The bumps correspondingly connected with the pads. The packaging material encapsulates the multi-function IC. The solder joints are disposed on the packaging material at intervals. The circuit board is disposed on the solder joints. An image identification circuit is disposed on the circuit board. When the image identification circuit detects an object, the image identification circuit identifies whether an image of the object matches a default image and the multi-function IC selectively performs a default function according to an identification result of the image identification circuit.

Description

technical field [0001] The present invention relates to the packaging of integrated circuits, in particular to a packaging structure and method for multifunctional integrated circuits. Background technique [0002] Please refer to figure 1 , figure 1 It is a schematic diagram of the front of a general smart phone. Such as figure 1 As shown, the display panel 12 of the smart phone 1 includes a display area (Display Area) 12A for displaying images and a circuit for connecting the display driver integrated circuit 11, the display panel circuit and other control circuits from the circuit board (PCB or FPC). Border Area 12B. In addition, if the smart phone 1 also includes the fingerprint reader 13 , then the smart phone 1 needs to add an additional border area to install the fingerprint detector 13 , resulting in a reduced area of ​​the display area 12A and an excessively wide upper border. [0003] Please refer to figure 2 , figure 2 It is a schematic diagram of a conve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L21/56
Inventor 黄志豪
Owner RAYDIUM SEMICON