A die-cut waste discharge device and a die-cut waste discharge method for die-cut parts with an inner frame
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YUANRANG IND SHANGHAI
- Publication Date
- 2018-05-11
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a die-cutting waste discharge device and method, in particular to a die-cut waste discharge device with inner frame die-cut parts. Background technique
[0002] The die-cutting machine is used in various materials such as self-adhesive materials, protective films, electronic shielding materials, PVC, film, Mylar paper, copper and aluminum foil, double-sided adhesive tape, foam cotton, and LCD reflectors, diffusers, Die-cutting of buffer sheets, glossy films, silicone tapes, etc., are widely used in electronics, IT and automobile manufacturing industries.
[0003] figure 1 The main material of the product shown is double-sided adhesive tape with a thickness of 0.2MM, and a layer of blue release film with a thickness of 0.075MM underneath. figure 1 The middle A area is hollowed out for the inner frame, figure 1 Middle B refers to the glue area; when processing this product, because the double-sided adhesive is too thick, it wi...