A die-cut waste discharge device and a die-cut waste discharge method for die-cut parts with an inner frame

Abstract

The invention relates to a die-cutting waste discharge device with an inner frame die-cutting piece and a die-cutting waste discharge method. The die-cutting waste discharge device comprises a first opposite-pressing roller, first-stamping die-cutting cutters, first waste discharge rollers, a second opposite-pressing mechanism, second-stamping die-cutting cutters and second waste discharge rollers which are arranged sequentially. The first opposite-pressing roller attaches a first single face gummed protective film to a first release film; indent inner frames are punched in first stamping by the first-stamping die-cutting cutters; the first waste discharge rollers is used to take up the first single face gummed protective films attached to wastes of the inner frames after the first-stamping punching; the second opposite-pressing mechanism attaches a second single face gummed protective film to the non-release surface of the first release film, and sequentially attaches double faced adhesive tape and a second release film to the release surface of the first release film; normal inner frames are punched in second-stamping by the second-stamping die-cutting cutters; the second waste discharge rollers are used to take up the second single face gummed protective films attached to wastes of the inner frames after the second-stamping punching; and the size of each normal inner frame is bigger than the size of each indent inner frame. Compared with the prior art, the die-cutting waste discharge device has the advantages that the effect of waste discharge is good, the product has no deformation, and efficiency is high.

Description

technical field [0001] The invention relates to a die-cutting waste discharge device and method, in particular to a die-cut waste discharge device with inner frame die-cut parts. Background technique [0002] The die-cutting machine is used in various materials such as self-adhesive materials, protective films, electronic shielding materials, PVC, film, Mylar paper, copper and aluminum foil, double-sided adhesive tape, foam cotton, and LCD reflectors, diffusers, Die-cutting of buffer sheets, glossy films, silicone tapes, etc., are widely used in electronics, IT and automobile manufacturing industries. [0003] figure 1 The main material of the product shown is double-sided adhesive tape with a thickness of 0.2MM, and a layer of blue release film with a thickness of 0.075MM underneath. figure 1 The middle A area is hollowed out for the inner frame, figure 1 Middle B refers to the glue area; when processing this product, because the double-sided adhesive is too thick, it wi...

AI Technical Summary

Problems solved by technology

After testing, it is found that if the double-sided adhesive is pasted on the blue release film, the waste can not be discharged normally by directly punching the inner frame and pulling down the waste. It still cannot solve the waste of double-sided adhesive and the inner frame of the blue release film. Waste problem

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