Preparation mold of narrow-frame double-sided adhesive tape product

Abstract

The invention relates to a preparation mold of a narrow-frame double-sided adhesive tape product. The preparation mold comprises a first cutting die and a second cutting die which are sequentially arranged in the direction of a die cutting assembly line, wherein the first cutting die comprises a first cutting die panel and a protruding inner ring cutting edge arranged on the first cutting die panel; and the second cutting die comprises a second cutting die panel and a protruding outer ring cutting edge arranged on the second cutting die panel, and a protruding press-fit area is arranged in theouter ring cutting edge. Compared with the prior art, a protective film is pressed on a release film through a sawtooth-shaped line segment protrusion under high pressure, the release film is tightlyconnected with the protective film at the line segment protrusion in a middle to-be-discharged area, only the viscous force of the protective film and the release film in the middle to-be-dischargedarea is increased in the subsequent discharging process, the viscosity of a cutting position is not increased, and therefore an ideal waste discharging effect is achieved.

Description

technical field [0001] The invention relates to a die-cutting mold, in particular to a mold for preparing narrow-frame double-sided adhesive products. Background technique [0002] Double-sided adhesive products with a narrow outer frame have a large hollow area inside, see figure 1 and figure 2 , There is a release film on the bottom of the double-sided adhesive product. During the production process, the protective film on the backing of the product release film cannot be discharged immediately after cutting, because if the protective film of this layer is discharged, the hollow area of ​​the product is too large and there is no support, which will cause the overall deformation of the product. [0003] When the finished product is attached to the release film of the finished product tape, the product is supported by the release film of the tape, so the protective film can be removed at this step, and the blue release film can be discharged along with the protective film...

AI Technical Summary

Problems solved by technology

[0004] However, since the viscosity of this layer of protective film cannot be too high, when the viscosity is too high, the cut part still has a relatively high viscosity. The reason is that the viscosity of the protective film is related to the adhesive material on the bonding surface. The more bonding materials, The stronger the viscosity, the stronger the viscosity, although the release film can be easily taken away during discharge, the adhesive material at the cutting part will take away the release film on the product together, and when the viscosity is low, although it will not take Remove the release film on the product, but the release film inside the product will not be 100% discharged, and the release film that has not been discharged needs to be removed manually, which will cause part of the product to be dirty

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