Image sensor package

An image sensor and package technology, which is applied in the fields of electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., can solve the problems of increased cost, complex structure, and multiple processes of packages.

Inactive Publication Date: 2017-05-10
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Meanwhile, as a packaging method for applying an image sensor to a vehicle, an image sensor molded ball grid array (ImBGA) packaging method or a wafer-level chip-scale package (WLCSP) method is mainly used, which has a problem in that due to the chip-on-board Package on Package (COB) method requires more process and more complicated structure, resulting in increased cost of manufacturing packages

Method used

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Embodiment Construction

[0018] Hereinafter, embodiments of the inventive concept will be described with reference to the accompanying drawings.

[0019] However, inventive concepts may be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0020] Throughout the specification, it will be understood that when an element such as a layer, region or wafer (substrate) is referred to as being "on", "connected to" or "bonded to" another element When described, an element may be directly "on," "connected to," or "coupled to" another element, or other elements may be present therebetween. In contrast, when an element is referred to as being “directly on,” “directly connected to” or “directly coupled to” another element, there may be no intervening elements present or prese...

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Abstract

Provided is an image sensor package. The image sensor package includes a substrate in which an installation groove is formed; an image sensor which is installed in the installation groove; a glass member arranged to be separated from the top surface of the substrate; and a molding layer which is stacked to surround the side surface of the glass member.

Description

[0001] This application claims priority and benefit from Korean Patent Application No. 10-2015-0153751 filed in the Korean Intellectual Property Office on November 3, 2015, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to an image sensor package. Background technique [0003] Examples of packaging methods suitable for image sensors of cameras include various methods such as chip-on-board (COB) packaging, chip-on-flex (COF) printed circuit boards (PCB) Packaging, chip-on-glass (COG) packaging, wafer-level chip-scale packaging (WLCSP), image sensor molded ball grid array (ImBGA) packaging, plastic leadless chip carrier (plastic leadless) chip carrier, PLCC) package, etc. [0004] Meanwhile, as a packaging method for applying an image sensor to a vehicle, an image sensor molded ball grid array (ImBGA) packaging method or a wafer-level chip-scale package (WLCSP) method is mainly used, which has a problem in ...

Claims

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Application Information

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IPC IPC(8): H01L27/146H01L23/31H01L23/48
CPCH01L27/146H01L23/31H01L23/48H01L2224/8592H01L2224/85951H01L2924/00014H01L2924/19107H01L2224/48091H01L2224/48465H01L2224/48471H01L2224/48479H01L2224/73265H01L2224/4554
Inventor柳真文
OwnerSAMSUNG ELECTRO MECHANICS CO LTD