Computer-information security application device

Abstract

The invention provides a safety application device for computer informatization, which includes a computer mainframe, a heat dissipation base, a cooling liquid coil, a waterproof inner layer, a circulating water pump, a heat dissipation fan, an inner mesh surface, an outer mesh surface, an adsorption mesh surface, an installation layer and Multiple pieces of semiconductor cooling chips; the waterproof inner layer is set on the inner wall of the heat dissipation base, and the computer host sits in the heat dissipation base and is in contact with the waterproof inner layer; the refrigerant coil is placed in the heat dissipation base, and the circulating water pump is set on the rear end surface of the heat dissipation base The upper part is connected with the refrigerant coil; the cooling fan is set in the main computer, the inner net cover is covered on the cooling fan, the installation layer is set on the outer end surface of the inner net surface, and multiple semiconductor cooling chips are installed in the installation layer; the adsorption net The surface is arranged on the outer end surface of the installation layer, and the outer mesh surface is arranged on the outer end surface of the adsorption mesh surface. The invention can dissipate heat, cool the air, prevent dust and prevent moisture for the computer mainframe, which is beneficial to the long-term continuous and high-efficiency operation of the computer mainframe and ensures the safe application of the computer.

Description

technical field [0001] The invention relates to a computer device, in particular to a computer informatization security application device. Background technique [0002] The dust in the computer case and the heat in the computer case can greatly reduce the cooling effect of the computer, and even bury a safety hazard. When the dust in the chassis affects the heat dissipation performance, it also affects the life of the fan. In severe cases, the capacitor may burst or the hardware may be burned. In addition, too much dust and humid working environment will lead to short circuit of devices, which will cause burnout or breakdown of transistors or integrated circuits, and even cause fires in more serious cases, resulting in heavy losses. Contents of the invention [0003] In view of the above-mentioned defects and various deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a computer information security application device,...

AI Technical Summary

Problems solved by technology

[0002] The dust in the computer case and the heat in the computer case can greatly reduce the cooling effect of the computer, and even bury a safety hazard

When the dust in the chassis affects the heat dissipation performance, it also affects the life of the fan. In severe cases, the capacitor will burst or the hardware will be burned.

In addition, when there is too much dust and the working environment is humid, the device will be short-circuited, which will cause the failure of burning or breakdown of transistors or integrated circuits. In more serious cases, it may even cause a fire and cause heavy losses.

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