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Heating device and dismounting method of electronic component

A technology for heating equipment and electronic components, applied in electrical components, electrical components, metal processing equipment, etc., can solve problems such as troublesome work, damage to the pad of the substrate, damage to the substrate and surrounding electronic components, etc.

Active Publication Date: 2017-08-08
HAKKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the operator does not find the upward displacement of the electronic components, the operator will continue to provide heat energy to the substrate and the surrounding electronic components, causing the substrate and the surrounding electronic components to be thermally damaged
Or, in order to check whether the solder is sufficiently melted, the operator sometimes raises the heating equipment upwards, which causes trouble in the work
If the solder is not fully melted when performing this check, the land on the substrate will be damaged.

Method used

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  • Heating device and dismounting method of electronic component
  • Heating device and dismounting method of electronic component
  • Heating device and dismounting method of electronic component

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach ＞

[0029] The inventors of the present invention have developed a heating device that can visually confirm separation of an electronic component from a substrate without being hindered by other components arranged around the separated electronic component. In the first embodiment, an exemplary heating device will be described.

[0030] figure 1 It is a schematic sectional view of the heating device 100 of 1st Embodiment. refer to figure 1 , the heating device 100 will be described.

[0031] The heating device 100 is used to melt the bonding material SDR such as solder, and remove the electronic component ECT fixed on the substrate CTB. The electronic component ECT can be BGA (Ball Grid Array) or other electronic components. The principle of this embodiment is not limited to a specific type of electronic component ECT.

[0032] An operator may blow hot air through the heating device 100 to melt the bonding material SDR. Alternatively, a worker may bring a component heated to...

no. 2 Embodiment approach ＞

[0046] The holding mechanism may also include a suction tube for transmitting vacuum force generated by the vacuum device to the electronic component to attract the electronic component. When the coil spring wound around the suction tube is used as the urging portion, the space surrounded by the coil spring is effectively used as a space for arranging the suction tube. Therefore, designers can design a small holding mechanism. In the second embodiment, an exemplary heating device including a suction tube and a coil spring will be described.

[0047] image 3 It is a schematic cross-sectional view of 100 A of heating installations of 2nd Embodiment. refer to figure 1 with image 3 , the heating device 100A will be described. The description of the first embodiment can be followed for the components attached with the same reference numerals as those of the first embodiment.

[0048] The heating device 100A includes a holding mechanism 200A and an outer casing 300A. The ho...

no. 3 Embodiment approach ＞

[0058] The holding mechanism described in connection with the second embodiment applies an upward force to the suction tube and the electronic component sucked by the suction tube by elastic compression of the coil spring. Alternatively, the holding mechanism may utilize the elastic extension of the coil spring to exert an upward force on the suction tube and the electronic components sucked by the suction tube. In the third embodiment, an exemplary heating device that applies an upward force to the suction tube and the electronic component when the coil spring elastically expands will be described.

[0059] Figure 5 It is a schematic cross-sectional view of heating equipment 100B of the third embodiment. refer to figure 1 with Figure 5 , the heating device 100B will be described. The description of the second embodiment can be followed for the components attached with the same reference numerals as in the second embodiment.

[0060] Like the second embodiment, the heat...

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PUM

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Abstract

The invention discloses a heating device used for melting a bonding material for fixing an electronic component and dismounting the electronic component. The heating device comprises a holding mechanism having a holding portion for holding the electronic component and an outer shell which is arranged partly around the holding mechanism, the holding mechanism comprises a force-applying portion for applying an upward force to the holding portion and an index portion for performing displacement with the recovery of the force-applying portion brought by melting of the bonding material in a cooperative manner, and the outer shell includes a transparent region capable of watching the displacement of the index portion. Therefore, operation personnel can be informed of the opportunity to dismount the electronic component.

Description

technical field [0001] The present invention relates to a technique for disassembling electronic components joined with a joining material. Background technique [0002] Various techniques are known for disassembling electronic components fixed with bonding materials such as solder. US Pat. No. 6,131,791 discloses in its specification a heating device including a suction tube biased by a coil spring. The suction tube is connected to a vacuum device. When the top of the suction tube abuts against the surface of the electronic component and the vacuum device is activated, the electronic component is attracted to the top of the suction tube. [0003] The heating device described in US Pat. No. 6,131,791 includes a coil spring that urges the suction tube upward. After the solder for fixing the electronic component on the substrate is melted, the electronic component can be displaced upward together with the suction tube to be detached from the substrate. [0004] In many cas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04B23K1/018B23K3/08
CPCB23K1/018B23K3/08H05K13/0486
Inventor 寺冈巧知根本尚生
Owner HAKKO CO LTD