Manufacturing method of radiating fins for notebook computers

Abstract

The invention discloses a manufacturing method of radiating fins for notebook computers. The radiating fins are prepared by the following steps: respectively applying a graphite modifier onto the upper and lower surfaces of a polyimide film to obtain a treated polyimide film, so that the treated polyimide film consists of a polyimide film, a first coating layer and a second coating layer; under inert-gas protection, heating the treated polyimide film from room temperature to 240DEG C-260DEG C, then heating the treated polyimide film to 480DEG C-500DEG C after heat preservation, then heating the treated polyimide film to 780DEG C-820DEG C after heat preservation, then heating the treated polyimide film to 1200DEG C after heat preservation, and cooling the treated polyimide film, thereby obtaining a pre-burnt carbonized film; and heating the carbonized film to 2350DEG C-2450DEG C, conducting heat preservation, then heating the carbonized film to 2850DEG C-2950DEG C, and cooling the carbonized film, thereby obtaining the burnt graphite film. The manufacturing method improves the crystallinity, simultaneously overcomes the nonuniformity caused by excessive thermal shrinkage, and improves the two-way tensile property of a graphite layer.

Description

technical field [0001] The invention relates to a method for manufacturing a heat sink for a notebook computer, and belongs to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness