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Thermally Conductive Graphite Chips for Microelectronics

一种微电子器件、导热石墨的技术,应用在电子器材、电气元件、电气设备构造零部件等方向,能够解决聚酰亚胺薄膜产品质量和性能良莠不齐、影响散热双面贴膜散热性能、产品散热性能不稳定等问题,达到避免体积收缩、改善导热性能、提高致密性和结晶度的效果

Active Publication Date: 2017-01-11
STICK NEW MATERIALS JIANGSU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, unstable heat dissipation performance of the product, and poor reliability, which is not conducive to product quality control and affects the product. competitiveness

Method used

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  • Thermally Conductive Graphite Chips for Microelectronics
  • Thermally Conductive Graphite Chips for Microelectronics

Examples

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Effect test

Embodiment

[0028] Embodiment: A thermally conductive graphite patch for microelectronic devices, the thermally conductive graphite patch is attached between the heat sink 1 and the heating component 2, and the thermally conductive graphite patch includes a light peel-off PET film 3 and a heavy Peel-off PET film 4, between the light peel-off PET film 3 and the heavy peel-off PET film 4, a first heat-conducting adhesive layer 5, a graphite layer 6 and a second heat-conducting adhesive layer 7 are sequentially arranged; the graphite layer 6 Obtained by the following process method, which process method comprises the following steps:

[0029] Step 1. Raise the polyimide film from room temperature to 250°C at a speed of 4~6°C / min, keep it for 0.9~1.1 hours, then raise it to 400°C at a speed of 2.5~3.5°C / min, keep it for 1 hour and then lower it. to room temperature;

[0030] Step 2, on the upper and lower surfaces of the polyimide film through step 1, a layer of graphite modifier is applied ...

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Abstract

The invention discloses a heat conduction graphite patch for a microelectronic device. The heat conduction graphite patch comprises a first heat conduction adhesive layer, a graphite layer and a second heat conduction adhesive layer, the graphite layer is obtained through the following technique, and the technique comprises the following steps that the upper surface and the lower surface of a polyimide film after the first step are coated with graphite modifiers to obtain the processed polyimide film; the processed polyimide film is heated to 800 DEG C, heat preservation is carried out, and then the film is heated to 1200 DEG C to obtain a pre-burned carbonization film; a calender is adopted to calender the pre-burned carbonization film in the fourth step; the carbonization film is heated to 2400 DEG C, heat preservation is carried out, then the film is heated to 2900 DEG C, and therefore a mainly-burnt graphite film is obtained; the mainly-burnt graphite film obtained in the fifth step is calendered to obtain the graphite layer. The method avoids local overheating of adhesive tape, uniformity of heat conduction performance of the adhesive tape is achieved, the stability and reliability of heat dissipation performance of the patch are improved, and the cost of the patch is greatly reduced.

Description

technical field [0001] The invention relates to a heat-conducting graphite patch for microelectronic devices, belonging to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight ma...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCB32B7/06B32B7/12B32B9/007B32B9/045B32B27/18B32B27/281B32B27/36B32B37/02B32B37/1207B32B37/153B32B37/156B32B38/18B32B2250/40B32B2307/302B32B2307/54B32B2307/734B32B2457/00C04B35/522C04B35/524C04B35/62218C04B2235/656C04B2235/661C08G73/1067C08J7/0427C08J2379/08C08J2479/08C09J2203/326C09J2301/124C09J2301/30C09J2301/302C09J2400/10C09J2400/123C09J2467/005H05K7/2039H05K7/205
Inventor 金闯杨晓明
Owner STICK NEW MATERIALS JIANGSU CO LTD
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