Thermally Conductive Graphite Chips for Microelectronics
一种微电子器件、导热石墨的技术,应用在电子器材、电气元件、电气设备构造零部件等方向,能够解决聚酰亚胺薄膜产品质量和性能良莠不齐、影响散热双面贴膜散热性能、产品散热性能不稳定等问题,达到避免体积收缩、改善导热性能、提高致密性和结晶度的效果
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[0028] Embodiment: A thermally conductive graphite patch for microelectronic devices, the thermally conductive graphite patch is attached between the heat sink 1 and the heating component 2, and the thermally conductive graphite patch includes a light peel-off PET film 3 and a heavy Peel-off PET film 4, between the light peel-off PET film 3 and the heavy peel-off PET film 4, a first heat-conducting adhesive layer 5, a graphite layer 6 and a second heat-conducting adhesive layer 7 are sequentially arranged; the graphite layer 6 Obtained by the following process method, which process method comprises the following steps:
[0029] Step 1. Raise the polyimide film from room temperature to 250°C at a speed of 4~6°C / min, keep it for 0.9~1.1 hours, then raise it to 400°C at a speed of 2.5~3.5°C / min, keep it for 1 hour and then lower it. to room temperature;
[0030] Step 2, on the upper and lower surfaces of the polyimide film through step 1, a layer of graphite modifier is applied ...
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