2results about How to "Avoid volume shrinkage" patented technology

The application discloses a kind of phase change material vacuum defoaming barrel filling methods suitable for prefabricated high porosity block, it is related to phase change energy storage building material preparation process technical field, including the following steps: to the maintenance of prefabricated high porosity block to design age, retain top surface filling surface, the rest outer surface is coated with epoxy resin sealant normal temperature solidification, form pre-sealing layer;Organic phase change material is heated to higher than its phase transition temperature 10~15 ℃ liquefaction and heat preservation;Pre-sealing block is loaded into openwork stainless steel mesh basket with filling surface upwards, overall is placed into vacuum defoaming barrel, inject phase change material to cover top surface, heating station overall heat preservation;After vacuum negative pressure filling, pressure relief, overall is taken out and drained remaining material, at service temperature environment cooling solidification, top surface sealing solidification is obtained finished product;The application realizes prefabricated block phase change material efficient uniform, low consumption safe batch filling by first pre-sealing then vacuum defoaming barrel mesh basket type filling process.

The application discloses a kind of conformal heat-conducting insulating composite material and its preparation method and application method, it is related to semiconductor packaging and thermal management technical field.The composite material includes: organic polysilazane resin 40-60 parts, toughening agent 4-10 parts, crosslinking agent 0.1-3 parts, low dielectric heat-conducting filler 35-85 parts, heat-conducting filler dispersant 0.3-2 parts, low volume shrinkage modifier 5-10 parts, catalyst 0.1-1 part, polymerization inhibitor 0.01-0.06 parts, solvent 5-90 parts;Wherein low dielectric heat-conducting filler is hexagonal boron nitride nanosheet, spherical silicon powder and the complex of undefined aluminum nitride, low volume shrinkage modifier is cage-type silsesquioxane.The composite material of the application can perfectly fill micron chip gap, volume shrinkage rate is low after solidification, interface thermal resistance is small, has excellent temperature resistance and high insulation, can satisfy the requirement of high-end equipment manufacturing field such as aerospace, high-performance computing to thermal management material.