9results about How to "Avoid volume shrinkage" patented technology

The invention discloses a reaction bonding silicon carbide ceramic membrane and a preparation method thereof, and belongs to the technical field of porous ceramics. The preparation method of the reaction binding silicon carbide ceramic membrane comprises the following steps: uniformly mixing first silicon carbide powder, first silicon powder and first titanium-silicon-iron alloy powder, adding an organic binding agent and a polyol plasticizer, and granulating and forming to prepare a support body green body; uniformly mixing second silicon carbide powder, second silicon powder, second titanium-silicon-iron alloy powder, a water-based polymer dispersant and water to obtain slurry, and coating the surface of the support body green body with the slurry to obtain a support body green body containing a film layer; and sintering the support body green body containing the membrane layer at 1200-1400 DEG C in a nitrogen-containing gas atmosphere to obtain the reaction bonding silicon carbide ceramic membrane. The reaction combined silicon carbide ceramic membrane prepared by the method has excellent thermal shock resistance.

The application discloses a low-shrinkage antibacterial denture base resin composite material and a preparation method thereof, relates to the field of preparation of the low-shrinkage antibacterial denture base resin composite material, and comprises a methyl methacrylate resin matrix, grafted modified nano silicon dioxide, a chitosan zinc composite antibacterial powder and a crosslinking modified additive. The low-shrinkage antibacterial denture base resin composite material and the preparation method thereof have the advantages that the process steps are progressive and mutually complementary, the modification of the powder provides a structural basis for low shrinkage and long-acting antibacterial properties, the gradient curing and locking of the modified powder lock the functional characteristics, the post-processing technology further stabilizes the comprehensive performance of the material, the problems that the antibacterial performance, the low-shrinkage performance and the mechanical performance cannot be considered simultaneously in the traditional technology are solved, and through the synergistic process of powder fine pretreatment, step-by-step homogeneous mixing, gradient segmented prepolymerization curing and constant-temperature aging post-processing, remarkable technical progress and practical effects are achieved.

The invention discloses a wear-resistant adhesive and a preparation method thereof, and relates to the technical field of adhesives. According to the invention, 4-phenylbutyltrimethoxysilane is utilized to modify fumed alumina and fumed silica, so that the fumed alumina and fumed silica have enhanced oleophylic properties and can be uniformly dispersed in organic silicon resin, and meanwhile, the high temperature resistance and bonding strength of a matrix are improved; the heat resistance of a matrix is improved, curing of resin colloid is promoted, the high temperature resistance and bonding strength of the colloid are improved, titanium and boron carbide are used as reinforcing agents, so that the bonding strength and the high temperature resistance of the colloid are greatly improved, then the colloid is subjected to plasma treatment and then soaked in a composite silane coupling agent, and the bonding strength and the high temperature resistance of the colloid are improved. Therefore, the adhesive force between the colloid and the base material is enhanced.

The invention relates to a compound for forming a metal-containing film, a composition for forming a metal-containing film, and a pattern forming method. The present invention addresses the problem of providing: a metal compound which has excellent dry etching resistance with respect to known organic underlayer film materials and also has a high degree of landfill / planarization characteristics; a metal-containing film-forming composition using the compound; and a pattern forming method in which the composition is used in a resist underlayer film material. [Solution] A metal-containing compound for forming a film, which is a reaction product of a compound having two or more diol structures in each molecule and an Sn compound, and which is characterized by being a monomolecular compound containing two or more Sn atoms in each molecule.

The invention relates to an FRP sleeve prestress device for reinforcing a reinforced concrete column and a construction method, and belongs to the technical field of construction of civil buildings, bridge engineering, ancient buildings, water supply and drainage engineering and the like. When the FRP sleeve method is adopted for reinforcement, the high-strength characteristic of the FRP material can be exerted only by applying prestress, and the utilization efficiency of the material is improved. The FRP sleeve is made of an FRP coiled material, circumferential prestress is applied to the whole FRP sleeve through a mechanism located in the sleeve, and ultra-high performance concrete is poured on the inner side of the FRP sleeve. The FRP sleeve is simple in appearance, durable and attractive after being reinforced, and the FRP sleeve is not provided with external connecting pieces such as a clamp and an anchorage device and is also not provided with butt joints, so that the durability of internal concrete is ensured. The construction does not need large tensioning equipment, and the operation is simple. The FRP sleeve manufactured in the scheme is integrated, the bearing capacity of the reinforced concrete column after reinforcement can be greatly improved, workers with special skills are not needed, and cost is saved.

The invention provides aerogel based on a bisphenol A type diether dianhydride monomer and a preparation method thereof, and is characterized in that the preparation method comprises the following steps: step 1, synthesizing flame-retardant diamine; 2, carrying out condensation polymerization on the flame-retardant diamine and bisphenol A type diether dianhydride to obtain a polyamide acid prepolymer; step 3, mixing the polyamide acid prepolymer with the modified zirconium phosphate, and carrying out sol-gelation and freeze-drying, so as to obtain polyamide acid-zirconium phosphate composite aerogel; and 4, carrying out thermal imidization treatment to obtain the polyimide-zirconium phosphate composite aerogel. The aerogel provided by the invention is organic / inorganic composite aerogel, and through combination of rigid modified zirconium phosphate and flexible polyimide, the aerogel is endowed with excellent mechanical properties, high elasticity and high pressure resistance; the aerogel contains three flame-retardant groups of nitrogen, phosphorus and silicon, so that the heat-insulating and flame-retardant properties of the aerogel are remarkably improved.

The invention relates to a compound for forming a metal-containing film, a composition for forming a metal-containing film, and a pattern forming method. The present invention addresses the problem of providing a compound for forming a metal-containing film that has excellent dry etching resistance and also has a high degree of landfill / planarization characteristics. A metal-containing film-forming composition containing the compound; and a pattern forming method using the composition. The solution of the present invention is a metal-containing compound for forming a film, which is characterized in that the compound is represented by general formula (M). In the general formula (M), R1 and R2 are each independently an organic group or a halogen atom, and W is a divalent organic group represented by the following general formula (W-1) or (W-2).

The application discloses a kind of phase change material vacuum defoaming barrel filling methods suitable for prefabricated high porosity block, it is related to phase change energy storage building material preparation process technical field, including the following steps: to the maintenance of prefabricated high porosity block to design age, retain top surface filling surface, the rest outer surface is coated with epoxy resin sealant normal temperature solidification, form pre-sealing layer;Organic phase change material is heated to higher than its phase transition temperature 10~15 ℃ liquefaction and heat preservation;Pre-sealing block is loaded into openwork stainless steel mesh basket with filling surface upwards, overall is placed into vacuum defoaming barrel, inject phase change material to cover top surface, heating station overall heat preservation;After vacuum negative pressure filling, pressure relief, overall is taken out and drained remaining material, at service temperature environment cooling solidification, top surface sealing solidification is obtained finished product;The application realizes prefabricated block phase change material efficient uniform, low consumption safe batch filling by first pre-sealing then vacuum defoaming barrel mesh basket type filling process.

The application discloses a kind of conformal heat-conducting insulating composite material and its preparation method and application method, it is related to semiconductor packaging and thermal management technical field.The composite material includes: organic polysilazane resin 40-60 parts, toughening agent 4-10 parts, crosslinking agent 0.1-3 parts, low dielectric heat-conducting filler 35-85 parts, heat-conducting filler dispersant 0.3-2 parts, low volume shrinkage modifier 5-10 parts, catalyst 0.1-1 part, polymerization inhibitor 0.01-0.06 parts, solvent 5-90 parts;Wherein low dielectric heat-conducting filler is hexagonal boron nitride nanosheet, spherical silicon powder and the complex of undefined aluminum nitride, low volume shrinkage modifier is cage-type silsesquioxane.The composite material of the application can perfectly fill micron chip gap, volume shrinkage rate is low after solidification, interface thermal resistance is small, has excellent temperature resistance and high insulation, can satisfy the requirement of high-end equipment manufacturing field such as aerospace, high-performance computing to thermal management material.