Manufacturing process of heat-conductive film used for cell phones

A manufacturing process and technology of heat conduction stickers, applied in the direction of coating, etc., can solve the problems of uneven product quality and performance of polyimide film, affecting the heat dissipation performance of heat dissipation double-sided film, unstable heat dissipation performance of products, etc., to avoid volume shrinkage , low cost, simple and easy manufacturing method

Inactive Publication Date: 2017-10-20
HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide film is used in mobile phone film. Although polyimide film is sintered to obtain graphite heat sink, which is pasted on the heat source, it is limited by the product quality and performance of polyimide film. The good and the bad are mixed, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, and improved product heat dissipation. Unstable performance, poor reliability, not conducive to product quality control, affecting product competitiveness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A manufacturing process for a thermally conductive film for mobile phones, mainly comprising the following steps:

[0023] Step 1: Film pretreatment, heat the polyimide film to 220°C, place it in an incubator for 30 minutes, then raise it to 300°C and then cool it down to room temperature;

[0024] Step 2: apply graphite modifier, evenly apply a layer of graphite modifier on both sides of the polyimide film treated in step 1;

[0025] Step 3: Pre-firing, heat the polyimide film coated with graphite modifier in step 2 to 800°C, keep it warm for 60 minutes, then raise the temperature to 1000°C, keep it warm for 70 minutes, and cool to room temperature to obtain a pre-fired carbonized film ;

[0026] Step 4: calendering, using a calender to calender the pre-fired carbonized film in the step 3, so that its thickness is calendered to 0.3 mm;

[0027] Step 5: Main firing. Heat the polyimide film calendered in step 4 to 800°C, keep it warm for 30 minutes, then raise the temp...

Embodiment 2

[0036] A manufacturing process for a thermally conductive film for mobile phones, mainly comprising the following steps:

[0037] Step 1: Film pretreatment, heat the polyimide film to 230°C, place it in an incubator for 30-50 minutes, then raise it to 330°C and then cool it down to room temperature;

[0038] Step 2: apply graphite modifier, evenly apply a layer of graphite modifier on both sides of the polyimide film treated in step 1;

[0039] Step 3: Pre-firing, heat the polyimide film coated with graphite modifier in step 2 to 850°C, keep it warm for 75 minutes, then raise the temperature to 1100°C, keep it warm for 75 minutes, and cool to room temperature to obtain a pre-fired carbonized film ;

[0040] Step 4: calendering, using a calender to calender the pre-fired carbonized film in the step 3, so that its thickness is calendered to 0.6mm;

[0041] Step 5: Main firing. Heat the polyimide film calendered in step 4 to 850°C, keep it warm for 50 minutes, then raise the te...

Embodiment 3

[0048] A manufacturing process for a thermally conductive film for mobile phones, mainly comprising the following steps:

[0049] Step 1: Film pretreatment, heat the polyimide film to 250°C, place it in an incubator for 50 minutes, then raise it to 350°C and then cool it down to room temperature;

[0050] Step 2: apply graphite modifier, evenly apply a layer of graphite modifier on both sides of the polyimide film treated in step 1;

[0051] Step 3: Pre-firing, heat the polyimide film coated with graphite modifier in step 2 to 900°C, keep it warm for 90 minutes, then raise the temperature to 1200°C, keep it warm for 80 minutes, and cool to room temperature to obtain a pre-fired carbonized film ;

[0052] Step 4: calendering, using a calender to calender the pre-fired carbonized film in the step 3, so that its thickness is calendered to 0.8 mm;

[0053]Step 5: Main firing. Heat the polyimide film calendered in step 4 to 900°C, keep it warm for 60 minutes, then raise the tempe...

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Abstract

The invention discloses a manufacturing process of a heat-conductive film used for cell phones. The manufacturing process mainly includes the steps of: 1) pre-treating a thin film; 2) smearing a graphite modifier on the thin film; 3) pre-sintering the thin film; 4) calendering: calendering the pre-sintered carbonized film in the step 3) on a calender machine until the thickness of the film is 0.3-0.8 mm; 5) main sintering: heating the calendered polyimide thin film in the step 4) to 800-900 DEG C and maintaining the temperature for 30-60 min, and increasing the temperature to 900-1100 DEG C and maintaining the temperature for 10-30 min, and cooling the film to normal temperature to obtain the heat-conductive film. The manufacturing process is easy to carry out and is low in cost. The heat-conductive film is high in scraping strength and is high in heat conductivity. By uniformly smearing a layer of graphite modifier on both surfaces of the polyimide thin film, the heat conductive property in the vertical and horizontal directions is improved, so that heat dissipation uniformity of the film is achieved.

Description

technical field [0001] The invention belongs to the field of electronic products, and in particular relates to a manufacturing process of a heat-conducting film for mobile phones. Background technique [0002] Nowadays, with the development of computer technology, the trend of computer development is to develop lighter and thinner products. For example, mobile phones are becoming more and more popular because of their compact form factors. As these products become smaller in size, heat dissipation is always a consideration, as high temperatures can reduce the performance, reliability and lifespan of electronic devices. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer heat to ensure the normal operation of electronic equipment. A heat spreader i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/524C04B35/622C04B35/626C08J7/04C08L79/08C09D133/20C09D7/12
CPCC04B35/524C04B35/62218C04B35/6267C04B2235/48C04B2235/96C04B2235/9607C08J7/042C08J2379/08C08J2433/20C09D133/20C08L83/04C08K5/101
Inventor 齐慧
Owner HEFEI DONGHENGRUI ELECTRONICS TECH CO LTD
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