The invention discloses a high-compactability heat-conduction
adhesive film. The heat-conduction
adhesive film is jointed to the surface of a heating component, and comprises a
graphite layer, a heat-conduction gluing layer locating on the surface of the
graphite layer, and a release material layer. The
graphite layer is obtained through the following technological method comprising the following steps of
coating a layer of a graphite modifying agent on the upper surface and the lower surface of a
polyimide thin film so as to obtain a treated
polyimide thin film, wherein the graphite modifying agent is made from the following components in parts by weight: 28 parts of
pyromellitic dianhydride, 13.5 parts of BTDA, 25 parts of diaminodiphenylmethane, 24 parts of
dimethyl formamide, 9 parts of N-methylpyrrolidinone, 2.2 parts of glycol and 2.2 parts of
polydimethylsiloxane; and raising the temperature of the treated
polyimide thin film to 1200 DEG C, performing heat preservation, and performing cooling so as to obtain a prefiring
carbonization film. According to the high-compactability heat-conduction
adhesive film disclosed by the invention, puckers and volume shrinkage in the graphitization
sintering process are avoided, the compactability and the crystalinity are improved, and the heat-conducting properties in a
perpendicular direction and in a horizontal direction are further improved.