High-compactability heat-conduction adhesive film

Abstract

The invention discloses a high-compactability heat-conduction adhesive film. The heat-conduction adhesive film is jointed to the surface of a heating component, and comprises a graphite layer, a heat-conduction gluing layer locating on the surface of the graphite layer, and a release material layer. The graphite layer is obtained through the following technological method comprising the following steps of coating a layer of a graphite modifying agent on the upper surface and the lower surface of a polyimide thin film so as to obtain a treated polyimide thin film, wherein the graphite modifying agent is made from the following components in parts by weight: 28 parts of pyromellitic dianhydride, 13.5 parts of BTDA, 25 parts of diaminodiphenylmethane, 24 parts of dimethyl formamide, 9 parts of N-methylpyrrolidinone, 2.2 parts of glycol and 2.2 parts of polydimethylsiloxane; and raising the temperature of the treated polyimide thin film to 1200 DEG C, performing heat preservation, and performing cooling so as to obtain a prefiring carbonization film. According to the high-compactability heat-conduction adhesive film disclosed by the invention, puckers and volume shrinkage in the graphitization sintering process are avoided, the compactability and the crystalinity are improved, and the heat-conducting properties in a perpendicular direction and in a horizontal direction are further improved.

Description

technical field [0001] The invention relates to a high-density heat-conducting film, which belongs to the technical field of heat-dissipating film. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer h...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness