Heat conduction graphite flake and manufacturing process thereof

Abstract

The invention discloses a heat conduction graphite flake, and a manufacturing process thereof. The heat conduction graphite flake comprises a polyimide film, a first coating layer and a second coating layer, wherein the first coating layer and the second coating layer are respectively arranged on the upper surface and the lower surface of the polyimide film; the first coating layer and the second coating layer are formed by sintering a graphite modifier; the graphite modifier comprises the following components in parts by weight: 20-25 parts of benzophenonetetracarboxylic dianhydride, 14-16 parts of pyromellitic dianhydride, 22-26 parts of diaminodiphenyl methane, 25-35 parts of dimethylformamide, 1.8-2.5 parts of ethylene glycol, and 2.5-3 parts of polydimethylsiloxane. According to the heat conduction graphite flake, the heat conduction performance can be improved in the vertical direction and the horizontal direction, local overheat is avoided, the uniform heat conduction performance is achieved, and the stability and reliability of radiation performance of products are improved.

Description

technical field [0001] The invention relates to a graphite sheet for heat conduction and a manufacturing process thereof, belonging to the technical field of graphite sheet. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight mate...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation p