Heat conduction graphite patch for microelectronic device

Abstract

The invention discloses a heat conduction graphite patch for a microelectronic device. The heat conduction graphite patch comprises a first heat conduction adhesive layer, a graphite layer and a second heat conduction adhesive layer, the graphite layer is obtained through the following technique, and the technique comprises the following steps that the upper surface and the lower surface of a polyimide film after the first step are coated with graphite modifiers to obtain the processed polyimide film; the processed polyimide film is heated to 800 DEG C, heat preservation is carried out, and then the film is heated to 1200 DEG C to obtain a pre-burned carbonization film; a calender is adopted to calender the pre-burned carbonization film in the fourth step; the carbonization film is heated to 2400 DEG C, heat preservation is carried out, then the film is heated to 2900 DEG C, and therefore a mainly-burnt graphite film is obtained; the mainly-burnt graphite film obtained in the fifth step is calendered to obtain the graphite layer. The method avoids local overheating of adhesive tape, uniformity of heat conduction performance of the adhesive tape is achieved, the stability and reliability of heat dissipation performance of the patch are improved, and the cost of the patch is greatly reduced.

Description

technical field [0001] The invention relates to a heat-conducting graphite patch for microelectronic devices, belonging to the technical field of double-sided adhesive sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight ma...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

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