Pressure Sensitive Tapes for Microelectronic Devices

Abstract

The invention discloses a pressure sensitive adhesive tape for a microelectronic device. The pressure sensitive adhesive tape is attached to the surface of a heating part, and a graphite layer is obtained through the following process methods: respectively coating a graphite modifier on the upper surface and the lower surface of a polyimide film to obtain a treated polyimide film, wherein the graphite modifier consists of the following components in parts by weight: 25-30 parts of benzenetetracarboxylic anhydride, 10-15 parts of benzophenonetetracarboxylic anhydride, 20-28 parts of diaminodiphenylmethane, 20-25 parts of dimethyl formamide, 8-10 parts of N-methyl pyrrolidone, 1.5-2.5 parts of ethylene glycol and 2-3 parts of polydimethylsiloxane; raising the temperature of the treated polyimide film to 800 DEG C, keeping the temperature, raising the temperature to 1,200 DEG C, and obtaining a pre-sintered carbide film; rolling the pre-sintered carbide film in the step 4 by adopting a roller mill. The uniformity of heat-conducting property of the adhesive tape is realized, the heat dissipation performance, stability and reliability of the product are improved, and the cost of the product is greatly lowered.

Description

technical field [0001] The invention relates to a pressure-sensitive adhesive tape used for microelectronic devices, belonging to the technical field of heat dissipation film. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight ma...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. affect product competitiveness

Images