Manufacturing Process for Graphite Heat Sinks

Abstract

A manufacturing process for graphite radiating fins of the invention comprises the following steps: coating the upper and lower surfaces of a polyimide film with a layer of graphite modifier, wherein the polyimide film after processing is composed of a polyimide film, a first coating layer and a second coating layer, and the graphite modifier comprises, by weight, 20-25 parts of benzophenonetetracarboxylic dianhydride, 12-18 parts of pyromellitic dianhydride, 20-28 parts of diaminodiphenyl methane, 20-25 parts of dimethylformamide, 8-10 parts of N-methyl pyrrolidone, 1.5-2.5 parts of ethylene glycol, 2-3 parts of polydimethylsiloxane, and 0.8-1.5 parts of dibutyl phthalate; heating the polyimide film after processing from room temperature to 1200 DEG C to obtain a pre-fired carbonized film; and heating the carbonized film to 2850-2950 DEG C to obtain a fired graphite film. Uniform heat conduction performance is achieved, and meanwhile, the radiating performance, stability and reliability of products are improved, and the cost of products is greatly reduced.

Description

technical field [0001] The invention relates to a manufacturing process for graphite heat sinks, belonging to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, unstable heat dissipation performance of the product, and poor reliability, which is not conducive to product quality control and affects the product. competitiveness

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