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Pressure-sensitive adhesive tape with heat uniformity and for smart phone

A technology for smart phones and sensitive tapes, applied in adhesives, inorganic chemistry, film/sheet adhesives, etc., can solve the problem of uneven quality and performance of polyimide film products, affecting the heat dissipation performance of heat-dissipating double-sided film, products Unstable heat dissipation performance and other issues, to avoid volume shrinkage, improve thermal conductivity, improve compactness and crystallinity

Inactive Publication Date: 2019-01-29
江苏博之高新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating of the tape, improved product heat dissipation performance instability, poor reliability performance, and is not conducive to product quality control. Affecting the competitiveness of products, how to overcome the above technical problems has become the direction of efforts of those skilled in the art

Method used

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  • Pressure-sensitive adhesive tape with heat uniformity and for smart phone
  • Pressure-sensitive adhesive tape with heat uniformity and for smart phone
  • Pressure-sensitive adhesive tape with heat uniformity and for smart phone

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Embodiment

[0023] Embodiment: A heat-soaking pressure-sensitive adhesive tape for smart phones. The heat-dissipating double-sided film is attached between the heat-dissipating element 1 and the heating component 2. The heat-dissipating double-sided film includes a light-peelable PET film 3 and a heavy-duty film. Peel-off PET film 4, between the light peel-off PET film 3 and the heavy peel-off PET film 4, a first heat-conducting adhesive layer 5, a graphite layer 6 and a second heat-conducting adhesive layer 7 are sequentially arranged; the graphite layer 6 Obtained by the following process method, which process method comprises the following steps:

[0024] Step 1. Raise the polyimide film from room temperature to 250°C at a speed of 4-6°C / min, keep it for 0.9-1.1 hours, then raise it to 400°C at a speed of 2.5-3.5°C / min, keep it for 1 hour and then lower it to room temperature;

[0025] Step 2, on the upper and lower surfaces of the polyimide film through step 1, a layer of graphite mo...

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Abstract

The invention provides a pressure-sensitive adhesive tape with heat uniformity and for a smart phone. The adhesive tape is a heat-dissipating double-sided film which is bonded between a heat-dissipating member and a heat-generating member. The heat-dissipating double-sided film comprises a light release PET film and a heavy release PET film, wherein a first heat-conductive adhesive layer, a graphite layer and a second heat-conductive adhesive layer are sequentially arranged between the light release PET film and the heavy release PET film. The pressure-sensitive adhesive tape of the inventionavoids local overheating of the adhesive tape, realizes the uniformity of the thermal conductivity of the adhesive tape, improves the stability and reliability of the heat dissipation performance of aproduct, and greatly reduces the cost of the product.

Description

technical field [0001] The invention relates to the technical field of double-sided adhesive sheets, in particular to a heat-soaking pressure-sensitive adhesive tape for smart phones. Background technique [0002] The trend in computer development is to develop lighter and thinner products, for example, tablet computers and notebook computers are becoming more and more popular because of their compact form factors. As these products become smaller in size, heat dissipation is always a consideration, as high temperatures can reduce the performance, reliability and lifespan of electronic devices. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material to quickly transfer heat to ensure the normal operation of electronic equipment. A heat spreader is a heat exchanger that tr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/20C01B32/205
CPCC01B32/205C09J7/20C09J2301/124C09J2467/005
Inventor 毛建青曾辉肖本财李兰凤董文可袁小燕
Owner 江苏博之高新材料科技有限公司
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