Pouring sealant for filling gap between warhead charge and shell
A warhead and potting glue technology, applied in the field of potting glue, can solve problems such as falling off and loose charge, and achieve the effects of increasing binding force, easy potting and reducing the cost of charge process.
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Embodiment 1
[0022] A potting compound for filling the gap between the warhead charge and the shell, which consists of hydroxyl-terminated polybutadiene (HTPB), curing agent, plasticizer and curing catalyst, wherein R=[NCO] and The molar ratio of [OH] in hydroxyl-terminated polybutadiene (HTPB) is 1.2, the content of plasticizer is 1.5 times that of hydroxyl-terminated polybutadiene (HTPB), and the content of curing catalyst is 1.5 times that of hydroxyl-terminated polybutadiene (HTPB). ) content of 0.01wt%.
[0023] Further, the curing agent is isophorone diisocyanate (IPDI) or 1,6-hexamethylene diisocyanate (HDI).
[0024] Further, the plasticizer is isodecyl nonanoate (TOA), di(2-ethylhexyl) sebacate or dioctyl sebacate (DOS).
[0025] Further, the curing catalyst is dibutyltin dilaurate (DBTL).
Embodiment 2
[0027] A potting compound for filling the gap between the charge of the warhead and the casing, the composition of which includes hydroxyl-terminated polybutadiene (HTPB) and a curing agent, wherein R=[NCO] and hydroxyl-terminated polybutadiene (HTPB) in the curing agent The molar ratio of [OH] in HTPB) is 0.8.
[0028] Further, the curing agent is toluene diisocyanate (TDI) or diphenylmethane-4,4'-diisocyanate (MDI).
Embodiment 3
[0030] A potting compound for filling the gap between the warhead charge and the shell, which consists of hydroxyl-terminated polybutadiene (HTPB), curing agent, plasticizer and curing catalyst, wherein R=[NCO] and The molar ratio of [OH] in hydroxyl-terminated polybutadiene (HTPB) is 1, the content of plasticizer is 0.75 times that of hydroxyl-terminated polybutadiene (HTPB), and the content of curing catalyst is 0.75 times that of hydroxyl-terminated polybutadiene (HTPB). ) content of 0.005wt%.
[0031] Further, the curing agent is polyphenylpolymethylene polyisocyanate (PAPI) or polyphenylpolymethylene polyisocyanate (PAPI).
[0032] Further, the plasticizer is dioctyl adipate (DOA), dioctyl phthalate (DOP), dioctyl phthalate (DOP) or dibutyl phthalate (DBP ).
[0033] Further, the curing catalyst is metal salts, such as tin octoate, lead octoate, zinc octoate or tertiary amines, such as triethylenediamine.
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