35results about How to "Easy to potting" patented technology

A membrane supported biofilm reactor uses modules having fine, hollow fibres, for example, made from melt spun thermoplastic polymers treated after spinning to increase their permeability to oxygen, used, for example, in tows or formed into a fabric. In one module, one or more sheets of the fabric are potted into a module to enable oxygen containing gas to be supplied to the lumens of the hollow fibres. Various reactors and processes, for example to treat wastewater, using such modules are described. Mechanical, chemical and biological methods, for example endogenous respiration, are used to control the thickness of the biofilm.

The invention relates to a bi-component silicone pouring sealant for an LED optoelectronic display device and a method for manufacturing the same. The bi-component silicone pouring sealant is characterized in that the sealant is obtained through the reaction of components A and B by using alpha,omega-dihydroxy polydimethylsiloxane of which the structural formula shown on the right as a main material. The component A is prepared from the following components by weight portion through mixing: 100 portions of the alpha,omega-dihydroxy polydimethylsiloxane, 10 to 35 portions of organosilicon based gel, 0 to 50 portions of stuffing, and 10 to 30 portions of plasticizer; and the component B is prepared from the following components in portion by weight through mixing: 5 to 10 portions of cross-linking agent, 0.3 to 3 portions of coupling agent, 0.1 to 0.5 portion of titanate complex, 0.1 to 0.5 portion of diethyl hydroxylamine, 0.01 to 0.1 portion of dibutyltin dilaurate catalyst, and 2 to 10 portions of plasticizer. The silicone pouring sealant prepared by the method has the advantages of simple process flow, good adhesive property, excellent temperature and weather resistant properties, and good flow property, and can be widely applicable for embedding electronic devices such as the LED optoelectronic display device and the like.

The invention relates to an addition type heat-conducting silicone rubber and a preparation method thereof. The addition type heat-conducting silicone rubber is characterized in that 100 weight portions of vinyl silicone oil and 200 weight portions to 500 weight portions of heat-conducting material are dewatered and mixed in a vacuum kneader for 30 to 200 minutes with the temperature of 100 to 150 DEG C and the vacuum degree of 0.06 to 0.099 MPa so as to obtain base material; under normal temperature, 0.5 weight portion to 1.5 weight portions of hydrogeneous silicone oil, 0.01 weight portion to 0.06 weight portion of inhibitor and 3 weight portions to 10 weight portions of diluent are added and stirred in a stirrer for 15 to 40 minutes so as to obtain A glue; 100 weight portions of base material are taken, 0.25 weight to 0.75 weight portion of platinum catalyst and 3 weight portions to 10 weight portions are added and stirred in the stirrer for 15 to 40 minutes so as to obtain B glue.The A glue and the B glue with the same weight portions are taken, mixed evenly and defoamed for 3 to 10 minutes at the vacuum degree of 0.06 to 0.09 MPa so as to obtain addition type heat-conductingsilicone rubber. The heat-conducting silicone rubber is cured at normal temperature or low temperature, has good flow property and convenient use, has higher heat conductivity after fluidization and can be used for the components with the need of heat dissipation and heat transmission in the electronic appliance field.

The invention discloses a high-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and a preparation method thereof. The pouring sealant comprises a component A and a component B, wherein the component A is prepared by blending an epoxy resin, a reactive diluent, an antifoaming agent and an inorganic heat conductivity filler which is treated by a silane coupling agent; and the component B is a curing agent. According to the pouring sealant, aluminum oxide and zinc oxide are adopted to provide high heat conductivity and insulation properties, the heat conductivity coefficient can be 1.75-2.23W.m.K, the volume resistivity is 3.25-5.91*10<15>omega / cm, the viscosity of the pouring sealant is greatly reduced by adopting the reactive diluent containing a plurality of active end groups, and the viscosity of the pouring sealant is 19,800-29,800mPa.s (25 DEG C), so that the pouring sealant is beneficial for pouring; and by using a modified acid anhydride as the curing agent, the operable time of the pouring sealant at 25 DEG C can be more than 8h.

The invention discloses a wire high-voltage sealing structure, which belongs to the technical field of aluminum silver oxide batteries, and comprises a first non-metallic frame, a second non-metal frame, a base body, a non-metallic cover plate, an upper metal pressure plate and a lower metal plate with the same structure Pressing plate; the first non-metallic piece includes a lower cylindrical body and an upper cylindrical body; the second non-metallic piece has the same structure as the first non-metallic piece; a lock nut is connected to the outside of the base body; the upper metal pressing plate is a ring structure; The first non-metallic component, the second non-metallic component, the base body, the non-metallic cover plate, the upper metal pressure plate and the lower metal pressure plate are in a coaxial relationship; a second O-ring is arranged between the second non-metallic component and the base body ; The second non-metallic piece and the wire are directly provided with the first O-shaped sealing ring; the upper cylindrical body, the upper non-metallic cover plate and the upper metal pressure plate are fixedly connected. The invention improves the reliability of wire sealing under high pressure.

The invention discloses a low-stress thermal-conductive silicone gel composition which comprises vinyl-containing polydiorganosiloxane, a functional filler, hydrosiloxane, an extender and an adhesion promoter, and is crosslinked and formed under action of a catalyst. The low-stress thermal-conductive silicone gel composition has advantages of low stress, strong adhesion force, thermal conductivity and flame retardancy, and can protect electronic components under mechanical stress and thermal stress.

The invention provides a method for improving the overload resistance impact capacity of a semiconductor cooler. By the adoption of the method, the overload resistance impact capacity of the semiconductor cooler can be remarkably improved. According to the following technical scheme, the method includes the steps that firstly, the edges of bismuth telluride grains of three peripheral edges of the semiconductor cooler are covered and protected through epoxy glue, and vent holes are reserved in the bottom edge; a glue filling port of the semiconductor cooler is formed upwards, and the semiconductor cooler is vertically placed in a special tool so as to be heated; a glue injection needle cylinder is used for injecting the epoxy glue into the semiconductor cooler from the glue filling port under assistance of compressed air; after encapsulation is completed, the semiconductor cooler with the epoxy glue encapsulated and cooling fins of the semiconductor cooler are continuously heated, so that the epoxy glue fully flows in the cooling fins to soak all the bismuth telluride grains and the inner walls of ceramic boards, and air bubbles in the semiconductor cooler are exhausted; and finally, the cooling fins are taken out from the special tool and vertically placed so as to be naturally solidified for at least 24 h. By the adoption of the method, the problem that bismuth telluride grains are easy to break when bearing force or ceramic boards are damaged in the high overload environment in the prior art is solved.

The invention discloses a mixed gum chewing type soft capsule and a preparation method thereof. The capsule skin of the soft capsule is prepared from the following raw materials in percentage by mass: 20-40% of gellan gum, 10-15% of dextrin, 5-15% of gelatin, 15-30% of glycerol, 4-10% of a thickening agent, 10-20% of deionized water and 10-15% of a flavoring agent; and the content of the capsule is liquid or a semisolid medicament, a health food or a food. The capsule skin of the capsule disclosed by the invention takes a mixed gum consisting of the gellan gum, the gelatin and the dextrin as a gum base, wherein the gellan gum is the main component and is compounded with the gelatin to obtain the gum base, the gelling performance of the gum base has a synergistic effect, and the dextrin is beneficial for forming a gel with a stable structure; and the thickening agent is used for controlling syneresis and reducing the brittleness of the gum base, and the flavoring agent is used for increasing the mouthfeel and good smell while solving a hydration problem of the gellan gum. The mixed gum chewing type soft capsule is good in temperature resistance, suitable in capsule skin strength, thickness and toughness, and good in chewing property and mouthfeel, is difficult to deform and generate adhesion and oil leakage, and is high in stability and convenient to store and transport, and the product shelf life is prolonged.

The invention provides a single-valve pulse width modulation controller for a large-scale variable sprinkler irrigation machine, comprising: a power converter (1), a MAX485 chip (2), an STC15 single-chip microcomputer (3) and a solid-state relay (4); The power converter (1) is respectively connected with the MAX485 chip (2) and the STC15 single-chip microcomputer (3), the MAX485 chip (2) is connected with the STC15 single-chip microcomputer (3), and the STC15 single-chip microcomputer (3) is connected with the solid-state relay (4). The 485 bus control of the present invention meets the requirement of multiple water valves and long distances of the sprinkler irrigation machine, and the independent generation of PWM pulses of the present invention reduces the control task of the main controller of the sprinkler irrigation machine and reduces the real-time communication requirements of the entire system.