34results about How to "Easy to potting" patented technology

Bi-component epoxy resin pouring sealant and the preparation and the potting technology are disclosed, which comprises an epoxy resin A component and a cursing agent B component, wherein the curing agent B component at least comprises the mixing curing agent of cashew shell oil modified amine curing agent and fatty amine curing agent. The potting technology comprises mixing and stirring evenly the epoxy resin A component and the curing agent B agent to conduct the potting, and spraying a layer of absolute alcohol on the surface of the pouring sealant after 10-15 minutes. The advantages are that gel time is prolonged through adopting the mixing curing agent of cashew shell oil modified amine curing agent and fatty amine curing agent, the requirement of operation time is fulfilled, and the operation time can reach 20-30 minutes, thereby being beneficial for the encapsulation of housing with large capacity, and the pouring sealant of the invention has the effect of fast curing, wherein the curing time is 1-3 hours, and defoaming is accelerated through spraying a layer of absolute alcohol on the surface of colloid after pouring, thereby making the solid gel surface bright and flat after curing.

The invention relates to a bi-component silicone pouring sealant for an LED optoelectronic display device and a method for manufacturing the same. The bi-component silicone pouring sealant is characterized in that the sealant is obtained through the reaction of components A and B by using alpha,omega-dihydroxy polydimethylsiloxane of which the structural formula shown on the right as a main material. The component A is prepared from the following components by weight portion through mixing: 100 portions of the alpha,omega-dihydroxy polydimethylsiloxane, 10 to 35 portions of organosilicon based gel, 0 to 50 portions of stuffing, and 10 to 30 portions of plasticizer; and the component B is prepared from the following components in portion by weight through mixing: 5 to 10 portions of cross-linking agent, 0.3 to 3 portions of coupling agent, 0.1 to 0.5 portion of titanate complex, 0.1 to 0.5 portion of diethyl hydroxylamine, 0.01 to 0.1 portion of dibutyltin dilaurate catalyst, and 2 to 10 portions of plasticizer. The silicone pouring sealant prepared by the method has the advantages of simple process flow, good adhesive property, excellent temperature and weather resistant properties, and good flow property, and can be widely applicable for embedding electronic devices such as the LED optoelectronic display device and the like.

The invention discloses a pouring sealant for filling a gap between a charge and a shell of a warhead. The pouring sealant comprises hydroxyl-terminated polybutadiene, a curing agent, a plasticizer and a curing catalyst, wherein mol ratio of R=[NCO] in the curing agent to [OH] in the hydroxyl-terminated polybutadiene is 0.8-1.2, content of the plasticizer is 0-1.5 times that of the hydroxyl-terminated polybutadiene, and the content of the curing catalyst is 0-0.01wt% that of the hydroxyl-terminated polybutadiene. The pouring sealant disclosed by the invention can be used for effectively solving the problem of an inherent gap between the charge and the shell of the warhead of the conventional weapon, so that use safety performance of the warhead and penetration stability to a target are greatly improved; and by adopting the pouring sealant disclosed by the invention, fabricated charging can be carried out without prefabricating a grain, so that the warheads in various sizes and shapes are directly poured and moulded, the mass production capability is greatly improved and the charging process cost is greatly reduced.

The invention relates to black adhesive filling and sealing equipment for electronic transformer manufacturing, in particular to rotary black adhesive filling and sealing equipment for electronic transformer manufacturing. According to the rotary black adhesive filling and sealing equipment for electronic transformer manufacturing, a plurality of square frames are conveniently subjected to black adhesive filling and sealing, and labor is saved. According to the technical scheme, the rotary black adhesive filling and sealing equipment for electronic transformer manufacturing comprises a mounting frame, a first annular sliding rail, a first sliding block, a first connecting rod, a disc, a second annular sliding rail, a second sliding block, a first bearing seat, a first rotating rod and thelike; and the first annular sliding rail is connected to bottom in the mounting box. The effects that the multiple square frames are conveniently subjected to black adhesive filling and sealing, and the labor is saved are achieved; the square placement frames on the disc can rotate and thus are convenient to replace during black adhesive filling and sealing, and the square placement frames can rotate; and a discharge box can move left and right so that a black adhesive can be evenly filled.

The invention discloses a flexible insulation pouring sealant based on modified epoxy resin. The flexible insulation pouring sealant comprises the following components by mass percentage: 20-30% of a methyl vinyl silicone rubber, 15-25% of modified epoxy resin, 10-15% of gamma-(methacrylic acyloxy)propyl trimethoxy silane, 5-9% of boron oxide, 3-5% of a flexible additive, 0-2% of toluene, 0-1% of an antifoaming agent, 25-30% of an active diluent, 0.5-1.5% of a coupling agent, and 0.5-1.5% of a curing agent. The flexible insulation pouring sealant has good heat conduction and insulating properties, the viscosity of the pouring sealant is greatly reduced by adopting the reactive diluent containing a plurality of active end groups, the viscosity of the pouring sealant is low, so that the pouring sealant is beneficial for pouring; usage of the flexible additive increase flexibility of pouring sealant matrix, and the pouring can be easily realized during a pouring process.

The invention discloses the technical field of a pouring sealant, and particularly relates to the field of a low-viscosity display screen flame-retardant surface mounting pouring sealant. The low-viscosity display screen flame-retardant surface mounting pouring sealant is prepared from an ingredient A and an ingredient B according to the ratio of 10:1, wherein the ingredient A is prepared from hydroxyl-terminated polydimethylsiloxane, melamine cyanurate, aluminum hydroxide, white carbon black and white gas; the ingredient B is prepared from gamma-aminopropyltriethoxysilane, tetraethoxysilane and dibutyltin dilaurate; the melamine cyanurate and the aluminum hydroxide are matched to be used as flame-retardant agents; the flame-retardant stage of UL94V0 can be reached at low consumption; thecorresponding construction requirements can be met; the white gas is used as diluents, and can fast reduce the glue liquid viscosity; no influence on lamp beads, printed circuit boards and LED masks is caused, so that the glue liquid circulation performance is good; the pouring and sealing can be convenient; a phenomenon of bubbling since glue liquid cannot fast immerge into electronic devices canbe avoided.

The invention discloses an abrasion-resistant steel wire rope, relating to the technical field of manufacture of steel wire ropes. The abrasion-resistant steel wire rope comprises a rope core, outside of which inner-layer steel wire ropes, an inner-layer abrasion-resistant layer, outer-layer steel wire ropes and an outer-layer abrasion-resistant layer are sequentially arranged. The multiple strands of inner-layer steel wire ropes are arranged and wrapped outside the rope core. The multiple strands of outer-layer steel wire ropes are arranged and wrapped outside the inner-layer abrasion-resistant layer. The outer-layer abrasion-resistant layer is wrapped outside the multiple strands of outer-layer steel wire ropes. The inner-layer abrasion-resistant layer and the outer-layer abrasion-resistant layer are both polyurethane resin layers. The rope core is a metal wire rope core. Compared with a conventional steel wire rope, the abrasion-resistant steel wire rope helps to solve problems of the conventional steel wire rope such as poor abrasion-resistant performance and short service lifetime.

The invention discloses an organic silicon pouring sealant which comprises two components including a component A and a component B. The component A comprises vinyl, methyl vinyl MQ resin, a reinforcing filler and a catalyst. The component B comprises vinyl silicone oil, methyl vinyl MQ resin, hydrogen-containing silicone oil, a flame retardant, a silane coupling agent and a polymerization inhibitor. The preparation method comprises the following steps of: adding vinyl silicone oil, methyl vinyl MQ resin and a catalyst into a reaction kettle, dispersing at a low speed, adding a reinforcing filler, dispersing at a high speed, and defoaming in vacuum to obtain a component A; and adding vinyl silicone oil, methyl vinyl MQ resin and a polymerization inhibitor into a reaction kettle, dispersing at a low speed, adding hydrogen-containing silicone oil and a silane coupling agent, dispersing at a low speed, adding a flame retardant, dispersing at a high speed, and defoaming in vacuum to obtain a component B; The comparative tracking coefficient (CTI) of the organic silicon pouring sealant is larger than or equal to 600V, and the organic silicon pouring sealant is free of oil leakage, excellent in flame retardant property, small in viscosity and easy to pour.

The invention discloses yellowing resistant bi-component room-temperature curing transparent epoxy glue. The epoxy glue consists of a composition A and a composition B, wherein the composition A and the composition B are mixed in proportion at the mass ratio of 2 to 1; the composition A consists of the following components in percentages by weight: 88.0% to 92.0% of epoxy resin, 0.3% to 1.0% of adefoaming additive, 4.0% to 6.0% of an antioxidant and 3.0% to 7.0% of benzyl alcohol; and the composition B consists of the following components in percentages by weight: 99.0% to 99.5% of a curing agent and 0.5% to 1.0% of an epoxy resin yellowing resistant agent. The invention also discloses a preparation method of the yellowing resistant bi-component room-temperature curing transparent epoxy glue. The yellowing resistance of the epoxy glue can be improved effectively, the problem that a plate becomes warped by curing when a digital tube advertisement light-emitting word plate is manufactured is avoided, and the service life of the digital tube advertisement light-emitting word plate is prolonged more effectively.

The invention relates to a potting positioning and clamping device of a circular electric connector. The device comprises a first half clamp ring, a second half clamp ring, a support and a clamp head.The first half clamp ring is movably connected with the second half clamp ring. The support is fixed on the first half clamp ring in a pivoted manner. One end of the clamp head is pivoted to the support and the other end of the clamp head is movably buckled to the second half clamp ring. Meanwhile, the invention also relates to a use method of the potting sealing and positioning device. Accordingto the invention, precise positioning and clamping of a sol ring and the front end of an electric connector during potting of the circular electric connector are achieved; labor intensity of an operator and dependency on the skill level of the operator are reduced; and the yield and the efficiency of the potting ar improved.

The invention relates to a polyurethane pouring sealant and a preparation method and application thereof.The polyurethane pouring sealant is composed of a component A and a component B. The mass ratio of the component A to the component B is 40-60: 100, and the component A is prepared from, by weight, 10-40 parts of hydroxyl-terminated polybutadiene A, 5-20 parts of polymer polyol, 5-30 parts of plasticizer and 35-75 parts of isocyanate; the component B comprises the following raw materials in parts by weight: 20-60 parts of hydroxyl-terminated polybutadiene B, 5-30 parts of polymer polyol, 5-30 parts of a plasticizer, 5-25 parts of a chain extender, 5-40 parts of a flame retardant, 0.5-5 parts of carbon black, 0.01-1 part of a catalyst and 0.1-1 part of a defoaming agent; the hydroxyl-terminated polybutadiene A is a special hydroxyl-terminated polybutadiene with low functionality; the hydroxyl-terminated polybutadiene B is polyfunctional special hydroxyl-terminated polybutadiene and/or epoxidized special hydroxyl-terminated polybutadiene. The pouring sealant disclosed by the invention has the characteristics of high mechanical property, good adhesive property, excellent insulation and flame retardance and low-temperature resistance, and can be used for pouring and sealing electronic components such as cables.

The invention discloses high pressure resistant silicone gel for IGBTs. The silicone gel includes multiple components which are an A component and a B component with the mass ratio being (1 : 1)-(6 :1); the A component includes vinyl silicone oil, modified silicone oil and a catalyst; and the B component includes the vinyl silicone oil, a reinforcing material, hydrogen-containing silicone oil anda polymerization inhibitor. A preparation method of the silicone gel is also disclosed. The dielectric strength of the silicone gel is high (the dielectric strength is greater than or equal to 30 KV/mm), so that the technical problems, that silicone gel on the market cannot satisfy the encapsulation requirements of IGBT high-voltage modules, can be solved.

A waterproof snap-action thermostat with a buckle frame comprises a snap-action thermostat, an outer sleeve and the buckle frame, the outer sleeve is provided with a cavity and a first positioning surface, and is integrated with the snap-action thermostat in a matching and encapsulating manner, and the outer sleeve is further provided with a second positioning surface and a convex hook table, andis movably connected with the elastic buckle frame in a matching and hooking mode. The snap-action thermostat and the outer sleeve are encapsulated, and then elastic buckle frame is movably mounted, so tool clamps are greatly reduced, the operation difficulty is reduced, the production efficiency is improved, the production cost is reduced, and the adaptability of the product is improved.

The invention discloses a transformer encapsulating material as well as a preparation method and an application thereof. The preparation method comprises the steps as follows: (1), resin, quartz powder and an organic solvent are mixed to obtain a mixture M1; and (2), a curing agent is added into the mixture M1 for mixing so as to obtain the transformer encapsulating material. For 100 parts by weight of the resin, 10-50 parts by weight of quartz powder, 50-100 parts by weight of the organic solvent and 10-40 parts by weight of the curing agent are used. The organic solvent is added in the resin material, so that the liquidity of the resin material is greatly improved, and then the prepared resin material can facilitate transformer encapsulation; and besides, the quartz powder in certain proportion is added, the insulation performance of the material can be increased, meanwhile, the curing agent is matched, and accordingly, the prepared encapsulating material has better curing performance and is more suitable for being used in actual production.

The invention discloses a detonating device circuit board encapsulating method and vacuum system. The method comprises the following steps that component A silica gel and component B silica gel with the same weight are uniformly mixed and stirred to obtain a mixed gel solution; vacuum defoaming is carried out on the mixed glue solution through the vacuum system; the defoamed mixed gel solution is used for conducting encapsulating on a detonating device circuit board; and medium-high temperature curing molding is performed on the encapsulated circuit board. According to the method and system, the problem that large-scale automatic vacuum encapsulation equipment cannot be adopted for encapsulation of a small number of circuit boards in the prior art is solved so that the small number of the circuit boards can be conveniently and quickly encapsulated.