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Flexible insulation pouring sealant based on modified epoxy resin

A technology of epoxy resin and potting glue, applied in the field of potting glue, can solve the problems of detachment of substrate components, insufficient flexibility, and high cross-linking density, and achieve the effects of increased flexibility, good thermal conductivity and insulation, and low viscosity

Inactive Publication Date: 2016-06-01
NANJING AILU NEW ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem faced by epoxy resin is that its crosslinking density is high after curing, it is brittle, easy to crack, easy to cause detachment between substrate components, and insufficient flexibility
This defect largely limits its application in some technical fields

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A flexible insulating potting compound based on modified epoxy resin, the ratio of raw materials includes:

[0038] Methyl vinyl silicone rubber 25%;

[0039] Modified epoxy resin 20%;

[0040] γ-(Methacryloyloxy)propyltrimethoxysilane 13%;

[0041] Oxide Peng 7%;

[0042] Flexible additive 4%;

[0043] Toluene 1%;

[0044] Defoamer 0.5%;

[0045] Active diluent 27.5%;

[0046] Coupling agent 1%;

[0047] Curing agent 1%.

[0048] The modified epoxy resin is organic titanium modified epoxy resin; the flexible additive is poly(dimethylsiloxane and diphenylsiloxane); the reactive diluent is 1,6- Hexylene glycol diglycidyl ether; the coupling agent is a titanate coupling agent; the curing agent is methylene bicyclohexaneamine.

[0049] The invention provides a flexible insulating potting glue based on modified epoxy resin, which has good thermal conductivity and insulation performance, and adopts an active diluent containing multiple active end groups to significa...

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PUM

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Abstract

The invention discloses a flexible insulation pouring sealant based on modified epoxy resin. The flexible insulation pouring sealant comprises the following components by mass percentage: 20-30% of a methyl vinyl silicone rubber, 15-25% of modified epoxy resin, 10-15% of gamma-(methacrylic acyloxy)propyl trimethoxy silane, 5-9% of boron oxide, 3-5% of a flexible additive, 0-2% of toluene, 0-1% of an antifoaming agent, 25-30% of an active diluent, 0.5-1.5% of a coupling agent, and 0.5-1.5% of a curing agent. The flexible insulation pouring sealant has good heat conduction and insulating properties, the viscosity of the pouring sealant is greatly reduced by adopting the reactive diluent containing a plurality of active end groups, the viscosity of the pouring sealant is low, so that the pouring sealant is beneficial for pouring; usage of the flexible additive increase flexibility of pouring sealant matrix, and the pouring can be easily realized during a pouring process.

Description

technical field [0001] The invention relates to the technical field of potting glue, and relates to a flexible insulating potting glue based on modified epoxy resin. Background technique [0002] Potting glue, also known as electronic glue, is a broad term. Used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. Only when the potting glue is completely cured can its use value be realized. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance, and shock resistance. There are many types of electronic potting adhesives. From the type of material, the most commonly used are three types, namely epoxy resin potting adhesive, silicone resin potting adhesive, and polyu...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J163/00C09J11/04C09J11/06C09K3/10
Inventor 王晓东
Owner NANJING AILU NEW ENERGY TECH CO LTD
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