High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof

A technology of epoxy resin and low viscosity, which is applied in the direction of epoxy resin glue, chemical instruments and methods, non-polymer adhesive additives, etc. It can solve problems such as high viscosity, short operating time, and inability to meet heat dissipation requirements. , to achieve high thermal conductivity and insulation performance

Active Publication Date: 2015-05-06
HEFEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary epoxy resin potting adhesives cannot meet the heat dissipation requirements of some occasions due to their poor thermal conductivity. It is necessary to research and develop epoxy resin potting adhesives with high thermal conductivity. Generally, the epoxy resin is filled with thermally conductive fillers. Improve its thermal conductivity
[0004]Patent CN102515626A is filled with aluminum oxide, aluminum nitride, boron nitride inorganic thermal conductivity filler, the thermal conductivity of the epoxy castable is 1.1~1.3W / (m.K) , still cannot meet the heat dissipation requirements of some large-scale integrated circuits
Patent CN101974302A adopts filling spherical alumina to improve the thermal conductivity of epoxy resin, and the thermal conductivity of potting glue reaches 1.2~1.8 W / (m.K), but the cost of spherical alumina used is high
In addition, the heat-conducting epoxy resin potting glue also has the disadvantages of fast gelation, short operating time, high viscosity and difficult potting.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Weigh 100 parts of E-51 type epoxy resin, 23 parts of 1,4-hexanediol diglycidyl ether, 2.5 parts of polyoxyethylene polyoxypropylene pentaerythritol ether and stir in a high-speed disperser for 20 minutes, then add glycidyl ether Inorganic thermally conductive filler treated with oxypropyltrimethoxysilane: 450 parts of alumina with an average particle size of 6 μm, 300 parts of aluminum oxide with an average particle size of 4 μm, 250 parts of zinc oxide with an average particle size of 2 μm, and continue stirring for 20 minutes after feeding A component.

[0022] Weigh 100 parts of component A and mix with 7.1 parts of 1-methylhexahydrophthalic anhydride curing agent, vacuum defoaming for 30 minutes, the viscosity of the potting glue is 20800mPa.s (25°C); the potting glue is cured at 100°C for 3 hours, and the thermal conductivity It is 1.76 W / m.K, and the volume resistivity is 5.43×10 15 Ω / cm.

Embodiment 2

[0024] Weigh 100 parts of E-51 type epoxy resin, 27 parts of 1,6-hexanediol diglycidyl ether, 2.7 parts of polyoxyethylene polyoxypropylene glyceryl ether and stir in a high-speed disperser for 25 minutes, then add 3-ammonia Inorganic thermally conductive filler treated with propyltriethoxysilane: 495 parts of alumina with an average particle size of 6 μm, 330 parts of aluminum oxide with an average particle size of 4 μm, 275 parts of zinc oxide with an average particle size of 2 μm, and continue to stir for 25 minutes after feeding. A component.

[0025] Weigh 100 parts of component A and mix with 6.4 parts of 4-methyltetrahydrophthalic anhydride curing agent, vacuum defoaming for 30 minutes, the viscosity of the potting adhesive is 24500mPa.s (25°C); is 1.93 W / m.K, and the volume resistivity is 4.12×10 15 Ω / cm.

Embodiment 3

[0027] Weigh 100 parts of E-51 type epoxy resin, 29 parts of 1,2-cyclohexanediol diglycidyl ether, 2.9 parts of polyoxyethylene polyoxypropylene amine ether and stir in a high-speed disperser for 20 minutes, then add in sequence Inorganic thermally conductive filler treated with alkyltrimethoxysilane: 585 parts of alumina with an average particle size of 6 μm, 390 parts of aluminum oxide with an average particle size of 4 μm, 325 parts of zinc oxide with an average particle size of 2 μm, and continue stirring for 25 minutes to obtain A Component.

[0028] Weigh 100 parts of component A and mix with 5.6 parts of 1-methylhexahydrophthalic anhydride curing agent, vacuum defoaming for 30 minutes, the viscosity of the potting adhesive is 29800mPa.s (25°C); It is 2.22 W / m.K, and the volume resistivity is 3.47×10 15 Ω / cm.

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Abstract

The invention discloses a high-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and a preparation method thereof. The pouring sealant comprises a component A and a component B, wherein the component A is prepared by blending an epoxy resin, a reactive diluent, an antifoaming agent and an inorganic heat conductivity filler which is treated by a silane coupling agent; and the component B is a curing agent. According to the pouring sealant, aluminum oxide and zinc oxide are adopted to provide high heat conductivity and insulation properties, the heat conductivity coefficient can be 1.75-2.23W.m.K, the volume resistivity is 3.25-5.91*10<15>omega / cm, the viscosity of the pouring sealant is greatly reduced by adopting the reactive diluent containing a plurality of active end groups, and the viscosity of the pouring sealant is 19,800-29,800mPa.s (25 DEG C), so that the pouring sealant is beneficial for pouring; and by using a modified acid anhydride as the curing agent, the operable time of the pouring sealant at 25 DEG C can be more than 8h.

Description

technical field [0001] The invention relates to a high thermal conductivity insulating low viscosity epoxy resin potting glue and a preparation method thereof, belonging to the application field of polymer composite materials. Background technique [0002] Epoxy resin (EP) has good physical and chemical properties, excellent bonding strength, and good dielectric properties; and the curing shrinkage rate is small, the product has good dimensional stability, high hardness, and good flexibility. The solvent is stable and is widely used in various sectors of national defense and national economy. [0003] With the development of microelectronics and large-scale integrated circuits, circuit components are highly concentrated, and the heat dissipation of components has become a prominent problem. Ordinary epoxy resin potting adhesives cannot meet the heat dissipation requirements of some occasions due to their poor thermal conductivity. It is necessary to research and develop ep...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J11/06C09J11/04C09K3/10
Inventor 周正发黄艳娜徐卫兵任凤梅马海红
Owner HEFEI UNIV OF TECH
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