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Addition type heat conducting silicon rubber and manufacturing method thereof

A thermal conductive silicone rubber and addition molding technology, applied in the field of polymer materials, can solve problems such as the inability to meet the requirements of the rapid development of the electronics industry, the inability to cure and cure speed, and the lack of flow properties, achieving excellent thermal conductivity and outstanding flow properties. , conducive to the effect of potting

Active Publication Date: 2011-04-06
CHENGDU GUIBAO SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese patent CN1205721A discloses a silicone elastomer with high thermal conductivity and an elongation at break greater than 30%, and CN101168620A discloses a thermally conductive and flame-retardant liquid silicone rubber, but neither of these two patents mentions flow properties; 200610093711.3 discloses A thermally conductive siloxane composition that cannot be cured or cured very slowly at room temperature, and the curing time is very long, which cannot meet the requirements of the rapid development of the electronics industry

Method used

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  • Addition type heat conducting silicon rubber and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Example 1: Add 100 parts by mass of vinyl silicone oil with a viscosity of 400 mpa·s at a temperature of 25°C, 450 parts by mass of aluminum oxide, and 50 parts by mass of silicon nitride into a vacuum kneader, and at a temperature of 150°C, a vacuum degree of 0.06 MPa, dehydration and blending for 200 minutes to obtain the base material. Add 1 mass part of hydrogen-containing silicone oil with a hydrogen content of 0.5%, 0.01 mass part of 2-methyl-3-butynyl-2 alcohol, and 3 mass parts of octamethylcyclotetrasiloxane into a mixer and 100 mass parts base Stir and mix the materials for 30 minutes to obtain component A; add 0.25 parts by mass of alcohol solution of chloroplatinic acid and 3 parts by mass of octamethylcyclotetrasiloxane to a mixer and stir and mix with 100 parts by mass of the base material for 30 minutes to obtain component B ; After taking equal mass of component A and component B and mixing evenly, degassing at a vacuum degree of 0.06MPa for 3 minutes to...

Embodiment 2

[0043] Example 2: Add 100 parts by mass of vinyl silicone oil with a viscosity of 1000 mpa·s at a temperature of 25°C, 350 parts by mass of aluminum oxide, and 50 parts by mass of silicon carbide into a vacuum kneader. MPa, dehydration and blending for 120 minutes to obtain the base material. Add 2 parts by mass of hydrogen-containing silicone oil with a hydrogen content of 1%, 0.06 parts by mass of methyltris(methylbutynyloxy)silane, and 5 parts by mass of tetramethyltetravinylcyclotetrasiloxane into a mixer for neutralization 100 parts by mass of the base material were stirred and mixed for 30 minutes to obtain component A; 0.5 parts by mass of vinylsiloxane chelate of chloroplatinic acid and 5 parts by mass of tetramethyltetravinylcyclotetrasiloxane were added to the mixer and 100 parts by mass The mass parts of the base material were stirred and mixed for 30 minutes to obtain the B component; after taking the equal mass of the A component and the B component and mixing the...

Embodiment 3

[0044] Example 3: Add 100 parts by mass of vinyl silicone oil with a viscosity of 3000mpa·s at 25°C, 180 parts by mass of aluminum oxide, and 20 parts by mass of silicon carbide into a vacuum kneader. Mix for 30 minutes to obtain a base. Add 2 parts by mass of hydrogen-containing silicone oil with a hydrogen content of 0.75%, 0.03 parts by mass of methyltris(methylbutynyloxy)silane, and 10 parts by mass of hexamethyldisiloxane into a mixer to neutralize 100 parts by mass of base The material was stirred and mixed for 15 minutes to obtain component A; 0.75 parts by mass of vinylsiloxane chelate of chloroplatinic acid and 10 parts by mass of hexamethyldisiloxane were added to a mixer and stirred and mixed with 100 parts of base material for 40 Component B can be obtained in minutes; after mixing components A and B of equal mass, degassing at a vacuum degree of 0.09MPa for 10 minutes to obtain addition-type thermally conductive silicone rubber, the product performance test result...

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Abstract

The invention relates to an addition type heat-conducting silicone rubber and a preparation method thereof. The addition type heat-conducting silicone rubber is characterized in that 100 weight portions of vinyl silicone oil and 200 weight portions to 500 weight portions of heat-conducting material are dewatered and mixed in a vacuum kneader for 30 to 200 minutes with the temperature of 100 to 150 DEG C and the vacuum degree of 0.06 to 0.099 MPa so as to obtain base material; under normal temperature, 0.5 weight portion to 1.5 weight portions of hydrogeneous silicone oil, 0.01 weight portion to 0.06 weight portion of inhibitor and 3 weight portions to 10 weight portions of diluent are added and stirred in a stirrer for 15 to 40 minutes so as to obtain A glue; 100 weight portions of base material are taken, 0.25 weight to 0.75 weight portion of platinum catalyst and 3 weight portions to 10 weight portions are added and stirred in the stirrer for 15 to 40 minutes so as to obtain B glue.The A glue and the B glue with the same weight portions are taken, mixed evenly and defoamed for 3 to 10 minutes at the vacuum degree of 0.06 to 0.09 MPa so as to obtain addition type heat-conductingsilicone rubber. The heat-conducting silicone rubber is cured at normal temperature or low temperature, has good flow property and convenient use, has higher heat conductivity after fluidization and can be used for the components with the need of heat dissipation and heat transmission in the electronic appliance field.

Description

technical field [0001] The invention relates to an addition-type heat-conducting silicone rubber and a manufacturing method thereof, belonging to the field of polymer materials. Background technique [0002] With the development of science and technology, electronic components and logic circuits tend to be denser and miniaturized; higher requirements are placed on the stability of electrical appliances. In order to prevent the intrusion of moisture, dust and harmful gases to electronic components, slow down vibration, prevent external damage and stabilize component parameters, and minimize the adverse effects of the outside world, electronic components need to be potted. The improvement of electrical power requires potting compound to have good thermal conductivity and insulation performance at the same time. If the heat cannot be conducted in time, it is easy to form local high temperature, damage electronic components and components, and affect the reliability and normal ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08K13/02C08K3/22C08K3/34C08L83/05
Inventor 熊婷邱泽皓袁素兰王有治
Owner CHENGDU GUIBAO SCI & TECH
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