Organic silicon pouring sealant and preparation method thereof

A technology of silicone potting glue and hydrogen-containing silicon, which is applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., and can solve the problems of inability to meet flame retardancy requirements, low tracking resistance, and long service life. Low-level problems, to achieve the effects of easy potting, improved flame retardancy, fluidity and excellent foam release

Pending Publication Date: 2021-05-11
ZHUZHOU TIMES NEW MATERIALS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Ordinary silicone potting adhesives are prone to oil leakage and have a low service life in harsh environments such as high temperature and high pressure (CTI≤600V). At the same time, they are easy to burn (the limiting oxygen index is about 18%), which cannot meet the flame retardancy requirements.
Moreover, there are very few studies on the tracking resistance of silicone potting adhesives. Therefore, by increasing the relative tracking coefficient of silicone potting adhesives, the service life of silicone gels in harsh environments can be improved. At the same time, endowing the silicone potting compound with excellent oil-proof and flame-retardant functions is of great significance to the development of the modern electronics industry.

Method used

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  • Organic silicon pouring sealant and preparation method thereof
  • Organic silicon pouring sealant and preparation method thereof
  • Organic silicon pouring sealant and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] A silicone potting compound of the present invention, comprising A component and B component with a mass ratio of 2:1, wherein A component includes the following components:

[0036]

[0037]

[0038] Component B includes the following components:

[0039]

[0040] The preparation method of the silicone encapsulant of the present embodiment comprises the following steps:

[0041] (1) Preparation of component A:

[0042] Add 80g of terminal vinyl silicone oil, 10g of methyl vinyl MQ resin and 0.01g of catalyst into the reaction kettle, disperse at low speed for 0.5 hours (rotating speed is 500r / min), then add 10g of modified polyaryletherketone, and disperse at high speed for 30min ( Rotating speed is 1200r / min), finally vacuum defoaming 20min, makes A component;

[0043] (2) Preparation of component B:

[0044] Add 50g of terminal vinyl silicone oil, 10g of methyl vinyl MQ silicone resin and 0.01g of polymerization inhibitor into the reactor, disperse at low...

Embodiment 2

[0048] A silicone potting compound of the present invention, comprising a component A and a B component with a mass ratio of 3:1, wherein the A component comprises:

[0049]

[0050] Component B includes:

[0051]

[0052]

[0053] The preparation method of the silicone encapsulant of the present embodiment comprises the following steps:

[0054] (1) Preparation of component A:

[0055]Add 70g of terminal vinyl silicone oil, 15g of methylvinyl MQ resin and 0.05g of catalyst into the reactor, disperse at low speed for 0.5 hours (rotating speed is 500r / min), then add 15g of modified polyaryletherketone, and disperse at high speed for 30min ( Rotating speed is 1200r / min), finally vacuum defoaming 20min, makes A component;

[0056] (2) Preparation of component B:

[0057] Add 40g of terminal vinyl silicone oil, 20g of methyl vinyl MQ silicone resin and 0.03g of polymerization inhibitor into the reactor, disperse at low speed for 0.5 hours (rotating speed is 500r / min), ...

Embodiment 3

[0061] A silicone potting compound of the present invention comprises A component and B component with a mass ratio of 1:1, wherein A component comprises:

[0062]

[0063] Component B includes:

[0064]

[0065] The preparation method of the high-performance silicone encapsulant of the present embodiment comprises the following steps:

[0066] (1) Preparation of component A:

[0067] 60g vinyl-terminated silicone oil (vinyl content 0.23%, viscosity 2000mpa s), 40g vinyl-terminated silicone oil (vinyl content 0.57%, viscosity 300mpa s), 5g methyl vinyl MQ resin and 0.02g catalyst Add it into the reaction kettle, disperse at low speed for 0.5 hours (rotating speed: 500r / min), then add 20g of modified polyaryletherketone, disperse at high speed for 30min (rotating speed: 1200r / min), and finally vacuum defoam for 20min to obtain component A ;

[0068] (2) Preparation of component B:

[0069] 40g vinyl-terminated silicone oil (vinyl content 0.57%, viscosity 300mpa s), 20...

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Abstract

The invention discloses an organic silicon pouring sealant which comprises two components including a component A and a component B. The component A comprises vinyl, methyl vinyl MQ resin, a reinforcing filler and a catalyst. The component B comprises vinyl silicone oil, methyl vinyl MQ resin, hydrogen-containing silicone oil, a flame retardant, a silane coupling agent and a polymerization inhibitor. The preparation method comprises the following steps of: adding vinyl silicone oil, methyl vinyl MQ resin and a catalyst into a reaction kettle, dispersing at a low speed, adding a reinforcing filler, dispersing at a high speed, and defoaming in vacuum to obtain a component A; and adding vinyl silicone oil, methyl vinyl MQ resin and a polymerization inhibitor into a reaction kettle, dispersing at a low speed, adding hydrogen-containing silicone oil and a silane coupling agent, dispersing at a low speed, adding a flame retardant, dispersing at a high speed, and defoaming in vacuum to obtain a component B; The comparative tracking coefficient (CTI) of the organic silicon pouring sealant is larger than or equal to 600V, and the organic silicon pouring sealant is free of oil leakage, excellent in flame retardant property, small in viscosity and easy to pour.

Description

technical field [0001] The invention belongs to the technical field of silicone potting glue, in particular to a two-component silicone potting glue and a preparation method thereof. Background technique [0002] Silicone potting adhesive is a very excellent electronic packaging material, not only has good high and low temperature resistance, weather resistance, corrosion resistance and electrical properties, but also has a simple molding process, can be deep-cured, no by-products are produced during curing, and after curing The material has good dimensional stability and low linear shrinkage, and is widely used in the field of sealing and packaging of electronic components. Chemical performance and anti-leakage performance put forward new requirements. Ordinary silicone potting adhesives are prone to oil leakage, have a low service life in harsh environments such as high temperature and high pressure (CTI≤600V), and are flammable (limiting oxygen index is about 18%), which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/08C09J11/06
CPCC09J183/04C09J11/04C09J11/08C09J11/06C08K2003/2227C08L2205/035C08L2205/025C08L2201/02C08L2203/206C08L83/04C08L71/10C08K3/22C08K5/5435
Inventor 朱伟颜渊巍杨军高玮熊昌义陈琪秦伟蒋大伟
Owner ZHUZHOU TIMES NEW MATERIALS TECH
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