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The method of improving the anti-overload shock capacity of semiconductor refrigerator

A technology of shock capacity and refrigerator, applied in the operation mode of the machine, refrigerator, refrigeration and liquefaction, etc., can solve the problems of difficult application, and achieve the effect of easy process control, high reliability, and good temperature shock resistance performance.

Inactive Publication Date: 2017-08-25
SOUTH WEST INST OF TECHN PHYSICS
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  • Abstract
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AI Technical Summary

Problems solved by technology

Therefore, it is very difficult to improve the overload impact resistance of semiconductor refrigerators and realize the application in high overload environments.

Method used

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  • The method of improving the anti-overload shock capacity of semiconductor refrigerator
  • The method of improving the anti-overload shock capacity of semiconductor refrigerator

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Embodiment Construction

[0016] Attached below figure 2 The implementation of the present invention will be described in further detail.

[0017] refer to figure 1 . The semiconductor refrigerator includes bismuth telluride crystal grains 3 sandwiched between a cold-side ceramic plate 1 and a hot-side ceramic plate 2 and distributed in an array, and electrode leads 4 drawn from both sides of the hot-side ceramic plate.

[0018] According to the present invention, the following steps are adopted to improve the anti-overload impact capability of semiconductor refrigerators:

[0019] (1) Before potting, use alcohol to clean the semiconductor refrigerator 1 or 2 times to remove organic dirt adhering to the ceramic plate and crystal grains, and then bake it in an oven at 80°C for 20 to 30 minutes.

[0020] (2) Potting Use DG-4 epoxy glue to pot the semiconductor refrigerator, and pour the epoxy glue into the inside of the refrigeration chip. Prepare DG-4 epoxy glue, the volume ratio of the A and B com...

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Abstract

The invention provides a method for improving the overload resistance impact capacity of a semiconductor cooler. By the adoption of the method, the overload resistance impact capacity of the semiconductor cooler can be remarkably improved. According to the following technical scheme, the method includes the steps that firstly, the edges of bismuth telluride grains of three peripheral edges of the semiconductor cooler are covered and protected through epoxy glue, and vent holes are reserved in the bottom edge; a glue filling port of the semiconductor cooler is formed upwards, and the semiconductor cooler is vertically placed in a special tool so as to be heated; a glue injection needle cylinder is used for injecting the epoxy glue into the semiconductor cooler from the glue filling port under assistance of compressed air; after encapsulation is completed, the semiconductor cooler with the epoxy glue encapsulated and cooling fins of the semiconductor cooler are continuously heated, so that the epoxy glue fully flows in the cooling fins to soak all the bismuth telluride grains and the inner walls of ceramic boards, and air bubbles in the semiconductor cooler are exhausted; and finally, the cooling fins are taken out from the special tool and vertically placed so as to be naturally solidified for at least 24 h. By the adoption of the method, the problem that bismuth telluride grains are easy to break when bearing force or ceramic boards are damaged in the high overload environment in the prior art is solved.

Description

technical field [0001] The invention relates to a process method for improving the anti-overload impact ability of a semiconductor refrigerator, which mainly uses epoxy glue potting and reinforcement to improve the anti-overload impact ability of an ordinary semiconductor refrigerator. [0002] technical background [0003] Semiconductor refrigerators are also called thermoelectric refrigerators or thermoelectric refrigeration devices. Its working principle is to use the Peltier effect of semiconductor materials. , will generate energy transfer, the current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end, and the heat is released from the P-type element to the joint of the N-type element to become the hot end. The size of heat absorption and heat release is It is determined by the magnitude of the current and the number of pairs of semiconductor materials N and P. It is a refrigeration technology that produces negative ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02
Inventor 刘期斌黄海华向秋澄童静邱月瓴
Owner SOUTH WEST INST OF TECHN PHYSICS
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