Low stress thermally conductive silicone gel composition

A technology of gel composition and thermal conductive silicon, which is applied in the directions of adhesives, adhesive additives, polymer adhesive additives, etc. Attachment and other problems, to achieve good operability, improve heat dissipation efficiency, and facilitate potting.

Active Publication Date: 2020-08-11
宁波聚力新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since no thermally conductive filler is added, the thermal conductivity of its products is extremely low (only 0.2w / mk), and it is difficult to meet the heat dissipation requirements of electronic components
Patents CN105482465, CN104513487, CN105419339, etc. all relate to the preparation method of thermally conductive silicone gel, but none of them solve the problem of making silicone gel have good adhesion

Method used

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  • Low stress thermally conductive silicone gel composition

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] 100 parts vinyl-terminated polydimethylsiloxane, 60 parts aluminum hydroxide, 100 parts aluminum oxide, 5 parts graphene, 3 parts hexamethyldisilazane, 0.5 parts purified water, add to planetary power mixer and mix After 1 hour, the temperature was raised to 150° C., and the mixture was stirred and lowered for 2 hours, and 1 part of chloroplatinic acid-divinyltetramethyldisiloxane catalyst was dispersed uniformly to prepare component A.

[0039] 100 parts of vinyl terminated polydimethylsiloxane, 60 parts of aluminum hydroxide, 80 parts of aluminum oxide, 20 parts of silicon micropowder, 5 parts of graphene, 3 parts of hexamethyldisiloxane, 0.5 parts of purified water, add Mix in a planetary power mixer for 1 hour, raise the temperature to 150°C, stir and de-low for 2 hours, stir with 1 part of crosslinking agent (synthesis 1 of hydrogen-containing branched chain siloxane), 3 parts of extender, and 1.2 parts of acetylene cyclohexanol Disperse uniformly to prepare B comp...

Embodiment 2

[0043] 100 parts vinyl terminated polydimethyl-methyl vinyl siloxane, 60 parts aluminum hydroxide, 30 parts alumina, 60 parts silicon micropowder, 2.4 parts hexamethyldisilazane, 0.5 parts water added to Planetary Power In a mixer, stir at room temperature for 1 hour, stir at 150° C. for 2 hours, add 1 part of chloroplatinic acid-divinyltetramethyldisiloxane catalyst and disperse it uniformly to prepare component A.

[0044] 100 parts of vinyl-terminated polydimethyl-methyl vinyl siloxane, 60 parts of aluminum hydroxide, 30 parts of alumina, 60 parts of silicon micropowder, 2.4 parts of hexamethyldisilazane, 0.5 parts of purified water, add In a planetary power mixer, stirring at room temperature for 1 hour, stirring at 150 ° C for 2 hours, 1.2 parts of acetylene cyclohexanol, 2 parts of cross-linking agent (synthesis of hydrogen-containing branched siloxane 3), 5 parts of extender , stir and disperse uniformly to prepare B component.

[0045] Finally, the A component and the...

Embodiment 3

[0048] 95 parts of vinyl-terminated polydimethylsiloxane, 5 parts of polydimethyl-methyl vinyl siloxane containing vinyl on the side, and 10 parts of silicone resin powder, add them to a planetary power mixer, heat up and stir at 120°C After 2 hours of lowering, 1 part of chloroplatinic acid-divinyltetramethyldisiloxane catalyst was added and dispersed uniformly to prepare component A.

[0049]95 parts of vinyl-terminated polydimethylsiloxane, 5 parts of polydimethyl-methyl vinyl siloxane containing vinyl on the side, and 10 parts of silicone resin powder, add them to a planetary power mixer, heat up and stir at 120°C Take off for 2 hours, add 1 part of acetylene cyclohexanol, 1 part of crosslinking agent (synthesis 1 of hydrogen-containing branched chain siloxane), 6 parts of extender, stir and disperse evenly to prepare B component.

[0050] Finally, the A component and the B component are mixed and stirred uniformly according to the mass ratio of 1:1, and the low-stress the...

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Abstract

The invention discloses a low-stress thermal-conductive silicone gel composition which comprises vinyl-containing polydiorganosiloxane, a functional filler, hydrosiloxane, an extender and an adhesion promoter, and is crosslinked and formed under action of a catalyst. The low-stress thermal-conductive silicone gel composition has advantages of low stress, strong adhesion force, thermal conductivity and flame retardancy, and can protect electronic components under mechanical stress and thermal stress.

Description

technical field [0001] The present invention relates to the field of silicone gel, in particular to a low-stress thermally conductive silicone gel composition. Background technique [0002] In recent years, with the development of electronic components in the direction of smaller and lighter, the strength of electronic components is more susceptible to temperature changes. Therefore, a material with good flexibility, high strength, and high thermal conductivity is required to seal or fill electronic components to protect electronic components that are mechanically and thermally stressed. [0003] The low-stress thermally conductive silicone gel composition can have good stress relaxation, electrical properties, weather resistance, thermal conductivity and flame retardant properties through curing, so it is widely used in the sealing and filling of electrical and electronic components to protect the overall electronic components. Stability and extended service life. The inv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/06C09J11/08
CPCC08J3/24C08J3/246C08J2383/07C08J2483/05C08J2483/06C08J2483/07C08K2201/014C08L2201/02C08L2203/206C08L2205/02C08L2205/025C08L2205/03C08L2205/035C08L2312/00C09J11/04C09J11/06C09J11/08C09J183/04C08L83/06C08L83/04C08K13/02C08K2003/2227C08K3/04C08K5/5419C08K3/36C08K5/05C08K3/38C08K5/057C08K5/3475
Inventor 胡肖波刘锐胡杰陈深然
Owner 宁波聚力新材料科技有限公司
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