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Ultra-low stress addition type silicone rubber composition

A technology of silicone rubber and addition molding, which is applied in the field of ultra-low stress addition molding silicone rubber compositions, and can solve the problems of low elastic modulus, low stress, and difficulty in sealing the composition.

Active Publication Date: 2018-07-03
CHENGDU GUIBAO SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, silicone rubber materials, especially silicone potting materials, are mainly used for potting protection of large electronic components, power modules, etc. Patent ZL200510079207. amount and low stress, but this type of silicone gel lacks shape retention, and its use is limited. With the development of miniaturization of electronic equipment, the standardization and improvement of filling protection and electrical safety requirements in the microelectronics industry, the sealing composition raised a problem

Method used

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  • Ultra-low stress addition type silicone rubber composition
  • Ultra-low stress addition type silicone rubber composition
  • Ultra-low stress addition type silicone rubber composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] The structural formula is Me 3 SiO (MeViSiO) 20 (MePhSiO) 50 (Me 2 SiO) 30 SiMe 3 100 parts by mass of vinyl-containing organopolydisiloxane, the structural formula is Me 3 SiO(MeHSiO) 10 (MePhSiO) 10 (Me 2 SiO) 5 SiMe 3 15 parts by mass of a crosslinking agent, 0.5 parts by mass of a catalyst with a platinum content of 500 ppm, and a molecular structure of Me 2 HSiO(MePhSiO) 50 SiMe 3 30 parts by mass of the low-stress additive, mixed uniformly and cured to obtain an ultra-low stress addition type silicone rubber. The test results are shown in Table 1.

Embodiment 2

[0067] The structural formula is Me 3 SiO (MeViSiO) 2 (MeC 8 h 17 SiO) 40 (Me 2 SiO) 100 SiMe 3 100 parts by mass of vinyl-containing organopolydisiloxane, the structural formula is Me 3 SiO(MeHSiO) 2 (MeC 8 h 17 SiO) 8 SiMe 3 12 parts by mass of crosslinking agent, 0.1 part by mass of catalyst with platinum content of 3000ppm, molecular structure of Me 2 HSiO(MePhSiO) 40 SiMe 3 10 parts by mass of the low-stress additive and 100 parts by mass of aluminum hydroxide were mixed uniformly and cured to obtain an ultra-low stress addition type silicone rubber. The test results are shown in Table 1.

Embodiment 3

[0069] The structural formula is Me 3 SiO (MeViSiO) 30 (MeC 10 h 21 SiO) 10 (Me 2 SiO) 50 SiMe 3 100 parts by mass of vinyl-containing organopolydisiloxane, the structural formula is Me 3 SiO(MeHSiO) 2 (MeC 10 h 21 SiO) 6 (Me 2 SiO) 10 SiMe 3 5 parts by mass of a crosslinking agent, 0.3 parts by mass of a catalyst with a platinum content of 600 ppm, and a structural formula of Me 2 HSiO(MeC 10 h 21 SiO) 30 SiMe 3 20 parts by mass of the low-stress additive, 100 parts by mass of aluminum hydroxide, and 100 parts by mass of silicon micropowder, mixed uniformly and cured to obtain an ultra-low stress addition type silicone rubber. The test results are shown in Table 1.

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Abstract

The invention discloses an ultralow-stress addition-type organic silicon rubber composition, prepared from the following materials in parts by weight: 100 parts of vinyl-containing organic poly disiloxane, 5-15 parts of crosslinking agent, 0-300 parts of filler, 0.1-0.5 part of catalyst, and 0-30 parts of low-stress assistant. The ultralow-stress addition-type organic silicon rubber composition has ultralow stress and low elasticity modulus, can be used for protecting electronic device filling encapsulation, has heat conducting and inflaming retarding performance, can be used for protection when an electronic element receives mechanical stress due to temperature change, such as a solar inverter and an IGBT power supply, and also can be used for stress absorption and damping for an electric appliance possibly receiving strong external impact force.

Description

technical field [0001] The invention belongs to the field of organic silicon materials, and in particular relates to an ultra-low stress addition type organic silicon rubber composition. Background technique [0002] With the rapid growth of the electronic information industry, the miniaturization, light weight, and high-performance development of electronic instruments require high-density installation of circuit boards and electronic components, so circuit boards, electronic components CSP (chip size package) , IC and other semiconductor devices are increasingly miniaturized, thinned, and multi-terminalized. With the realization of high-density installation of electronic components, the strength of electronic components or semiconductor devices will become more fragile with temperature changes, and they need to be packaged for protection. This material must have a low elastic modulus and ultra-low stress to ease, To protect sensitive electronic components from mechanical ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/04C08K3/22C08K3/36
CPCC08L83/04C08L2201/02C08L2203/20C08L2205/025C08L2205/03C08K2003/2227C08K3/36
Inventor 熊婷雷震谭奎涂程李步春王有治
Owner CHENGDU GUIBAO SCI & TECH
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