4results about How to "Hydrophobic" patented technology

This invention discloses a display device, comprising: a first substrate including a plurality of sub-pixels; a plurality of light-emitting diodes (LEDs) in each of the plurality of sub-pixels disposed on the first substrate; a hydrophobic barrier disposed above the plurality of LEDs and exposed above them; a plurality of color conversion layers disposed on the plurality of LEDs and surrounded by the barrier; an encapsulation layer disposed on the plurality of color conversion layers and formed of an organic material; and a light-shielding layer disposed on the barrier and disposed on the side portion of the encapsulation layer. The area of ​​the encapsulation layer increases downwards, and the area of ​​the light-shielding layer decreases downwards.

The application belongs to the technical field of bio-based packaging materials, and particularly relates to a novel double-layer composite film and application thereof. The novel double-layer composite film comprises the following steps: reacting palmitic anhydride and carboxymethyl cellulose to obtain carboxymethyl cellulose palmitate; adding a pH-sensitive natural dye indicator to obtain carboxymethyl cellulose palmitate nanoemulsion containing a pH-sensitive substance; then loading a natural polymer material to prepare a film material; finally adding the film material to the carboxymethyl cellulose palmitate to prepare a composite film, thereby obtaining the novel double-layer composite film. The double-layer composite film can be self-emulsified without adding a surfactant, and has the ability to load functional indicator (pH-sensitive color indicator) substances; meanwhile, the barrier performance of the film material, such as a chitosan film, to water vapor and oxygen is improved, and the double-layer composite film has a very promising application in food or fruit preservation. The method provided by the application is not only green in raw materials, but also uses a flow casting method, which can be applied to industrial production and has a good application prospect.

A semiconductor structure, a method for forming the semiconductor structure, and an integrated circuit structure are disclosed. The method includes: providing a first substrate on which an electrode structure is formed, wherein the electrode structure is hydrophobic and the first substrate exposed by the electrode structure is hydrophilic; providing a polymer solution for forming a specific structure on the first substrate; providing a second substrate including a first surface and a plurality of spaced-apart walls protruding from the first surface, wherein the top surface of the walls is hydrophilic and the sidewalls and the exposed first surface of the walls are hydrophobic; dropping the polymer solution onto the top surface of the walls and placing the first substrate onto the second substrate to obtain an initial semiconductor structure; wherein the side of the first substrate with the electrode structure faces the second substrate, and the extension direction of the electrode structure is perpendicular to the extension direction of the walls; curing the polymer solution; and removing the second substrate from the initial semiconductor structure to obtain a target semiconductor structure. Embodiments of this disclosure improve device performance.

The present application relates to the technical field of fracturing aids, and is a temperature-controlled variable-density high-pressure-resistant proppant and a preparation method thereof.The raw materials of the temperature-controlled variable-density high-pressure-resistant proppant include a proppant, a surface modifier, a temperature-controlled polymer, an initiator and an organic solvent.The temperature-controlled variable-density high-pressure-resistant proppant is prepared by first modifying the surface of the proppant to obtain a modified proppant, then grafting and polymerizing the modified proppant with the temperature-controlled polymer, and finally post-treating the final product.The temperature-controlled variable-density high-pressure-resistant proppant can reduce the density under the response of the bottom-hole temperature, so that it is more easily transported to the deep part of a complex fracture network and uniformly laid, has a low breakage rate, can well support the fractures and promote the flow of oil and gas in the fractures.Meanwhile, the temperature-controlled variable-density high-pressure-resistant proppant still has high pressure resistance after swelling, so as to avoid being crushed to reduce the fracture width and block the seepage channel and reduce the fracture conductivity.