Preparation method of heat stable type insulation binder

Abstract

The invention relates to the technical field of binder preparation, in particular to a preparation method of a heat stable type insulation binder. Epoxidized soybean oil can play a role in promoting the curing cross-linking of a high-temperature binder, the heat resistance of the binder is improved through adding the cross-linking degree, and meanwhile, the high-temperature binder keeps appropriate cohesion strength. Phosphoric acid is added into a raw material prepared from a phenolic resin, so that the volume shrinkage after high-temperature heat treatment is inhibited, a binding performanceis improved, and favorable thermal shock resistance is realized; through heating reaction, transition metal molybdenum is bonded into a phenolic resin molecule main chain so as to form an O-Mo-O structure connected with a benzene ring in a phenolic resin, so that the thermal decomposition temperature of the insulation binder is improved. Metallic oxide and metal salt are adopted as modified additives, and the voltage impact resistance of the insulation binder can be improved, so that the insulation binder has excellent heat stability and has a wide application prospect.

Description

technical field [0001] The invention relates to the technical field of adhesive preparation, in particular to a method for preparing a thermally stable insulating adhesive. Background technique [0002] With the improvement of social economy and living standards, binders play an increasingly important role in people's daily life and production. Binders play an extremely important role in both high-tech and general modern chemical industries. [0003] Insulation adhesive is a composite adhesive with good electrical insulation properties. It can be used for casting cable joints, impregnating windings of motors, electrical appliances, generators, sealing and insulating transformers, capacitors or radio devices, etc., and surface protection of electrical and electronic components. It is widely used in aviation, aerospace, automobile, machinery, construction, chemical industry, light industry, electronics, electrical appliances and daily life. [0004] At present, insulating a...

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Problems solved by technology

[0007] The technical problem mainly solved by the present invention is that the insulating adhesives commonly used in electrical equipment are mainly epoxy resins, silicone resins, polyimides, phenolic resins, etc., and organic resin adhesives encounter high temperatures when used alone. It is easy to pyrolyze, so the thermal stability of insulating adhesives is generally poor, and the adhesion ability will decrease under high temperature conditions for a long time. A preparation method for thermally stable insulating adhesives is provided.

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