Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof

A technology of epoxy resin and oligomer, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., to achieve the effect of excellent bonding strength and high temperature resistance

Inactive Publication Date: 2010-12-29
INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the polysulfone resin modified epoxy resin adhesive with high molecular weight is only used as a glue film, and it can only be used as a paste glue by preheating to a higher temperature or using a solvent. Polysulfone oligomer thermosetting epoxy resin adhesive and preparation method thereof

Method used

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  • Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof
  • Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof
  • Polysulfone oligomer-containing thermosetting epoxy resin adhesive and preparation method thereof

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specific Embodiment approach 1

[0010] Embodiment 1: In this embodiment, the heat-cured epoxy resin adhesive containing polysulfone oligomer is diluted with 100 parts of epoxy compound, 5-60 parts of polysulfone oligomer, and 0-15 parts of epoxy agent, 10-50 parts of filler and 6-30 parts of epoxy curing agent.

[0011] In this embodiment, polysulfone oligomers are synthesized from bisphenol compounds and dichlorodiphenyl sulfone.

specific Embodiment approach 2

[0012] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the epoxy compound is a composition of one or two of polyurethane modified epoxy resin and bisphenol A epoxy resin; The epoxy value of the phenol A type epoxy resin is 0.44-0.54. Others are the same as in the first embodiment.

[0013] In this embodiment, when the epoxy compound is a combination of polyurethane modified epoxy resin and bisphenol A epoxy resin, the ratio between the two components is arbitrary.

specific Embodiment approach 3

[0014] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the polysulfone oligomer is polysulfone oligomer P-01, polysulfone oligomer P-02, polysulfone oligomer P-03, polysulfone oligomer P-04, polysulfone oligomer P-05 or polysulfone oligomer P-06. Others are the same as those in the first or second embodiment.

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Abstract

The invention discloses a polysulfone oligomer-containing thermosetting epoxy resin adhesive and a preparation method thereof, and relates to an adhesive and a preparation method thereof. The invention solves the problem that a polysulfone resin modified epoxy resin adhesive with high molecular weight is only used as an adhesive film and can be used as a pasty adhesive only when preheated to higher temperature or used together with a solvent. The adhesive is prepared from an epoxy compound, a polysulfone oligomer, an epoxy diluent, a filler and an epoxy hardener. The polysulfone oligomer-containing thermosetting epoxy resin adhesive does not contain solvents, is pasty, has excellent bonding strength and high temperature resistance, and has the shear strength of 25 to 36.4MPa at room temperature and at 100 DEG C and the shear strength of 15 to 25MPa at 150 DEG C.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] The development of modern science and technology has put forward increasingly extensive and demanding requirements for polymer materials, such as requiring polymers to be resistant to high temperatures and easy to process; to have excellent toughness and high hardness; to require good performance and low price , this multifaceted requirement is difficult to meet with a single homopolymer. This situation is especially true in the field of adhesives. Epoxy resin has many excellent characteristics, such as high bonding strength, small curing shrinkage, stable size, strong creep resistance, chemical resistance, excellent electrical properties, and easy access to raw materials. , easy to prepare, simple process, wide use temperature, wide application range, excellent durability, low toxicity, etc., but the crosslinking density of epoxy resin is high after c...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J181/06
Inventor 孙明明张斌张绪刚李坚辉王磊李奇力
Owner INST OF PETROCHEM HEILONGJIANG ACADEMY OF SCI
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