Heat conduction graphite sheet and manufacturing method thereof

Abstract

The invention discloses a heat conduction graphite sheet and a manufacturing method thereof. The heat conduction graphite sheet consists of a polyimide film, a first coating layer and a second coating layer, wherein the first coating layer and the second coating layer are positioned on the upper and lower surfaces of the polyimide film respectively and are formed by sintering graphite modifiers respectively; each graphite modifier consists of the following components in parts by weight: 20-25 parts of benzophenonetetracarboxylic dianhydride, 14-16 parts of benzenetetracarboxylic anhydride, 22-26 parts of diaminodiphenylmethane, 20-25 parts of dimethyl formamide, 8-10 parts of N-methyl pyrrolidinone, 1.8-2.5 parts of ethylene glycol and 2.5-3 parts of polydimethylsiloxane. The heat conduction performance of the heat conduction graphite sheet is improved in the vertical direction and the horizontal direction, local overheating is avoided, the uniformity of the heat conduction performance is realized, and meanwhile, the stability and reliability of the heat dissipation performance of a product are improved; the cost of the product is greatly reduced.

Description

technical field [0001] The invention relates to a heat-conducting graphite sheet and a manufacturing method thereof, belonging to the technical field of graphite sheets. Background technique [0002] With the rapid development of modern microelectronics technology, electronic devices (such as laptops, mobile phones, tablet computers, etc.) are increasingly becoming ultra-thin and lightweight. This structure makes the internal power density of electronic devices significantly increased, and the heat generated during operation is not easy to discharge , Easy to accumulate rapidly and form high temperature. On the other hand, high temperatures can reduce the performance, reliability and lifespan of electronic equipment. Therefore, the current electronics industry has put forward higher and higher requirements for heat dissipation materials as the core components of thermal control systems, and there is an urgent need for a highly efficient heat-conducting, lightweight material...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, polyimide films are mostly used for flexible circuit boards. Although polyimide films are sintered to obtain graphite heat sinks, which can be pasted on heat sources, they are limited by the quality and quality of polyimide films. The performance is uneven, which affects the heat dissipation performance of the heat dissipation double-sided film. There are the following technical problems: uneven heat dissipation, prone to local overheating, improved heat dissipation performance of the product is unstable, poor reliability performance, and is not conducive to product quality control. product competitiveness

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