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Separation net for cutting and method for cutting silicon wafers by the division net

A technology of dividing line and cutting line, which is used in fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problem of easy disconnection of the line

Active Publication Date: 2019-04-09
阜宁协鑫光伏科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide a wire branching net for cutting to solve the problem that the wires are easy to break.

Method used

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  • Separation net for cutting and method for cutting silicon wafers by the division net
  • Separation net for cutting and method for cutting silicon wafers by the division net

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Embodiment Construction

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no interveni...

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PUM

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Abstract

The invention relates to a wire separation net for cutting. The wire separation net comprises a cutting wire net arranged on a guide wheel, wherein the wire feeding end and the wire discharging end of the cutting wire net are respectively located at the head and the tail of the guide wheel; and a cutting wire net clearance is reserved at a position, which is located at the tail of the guide wheel, on the cutting wire net, so that the last cutting wire can carry out cutting outside a silicon block during cutting of the silicon block. The wire separation net for cutting can fulfill the aim that the last cutting wire of the cutting wire net can carry out the cutting outside the silicon block. As the last cutting wire does not fall within the cutting range of the silicon block, fluctuation of tension of the cutting wire is relieved, breakage of a wire due to jumping of the last cutting wire is avoided, and wear of a guide wheel slot of the guide wheel is avoided. The invention further provides a cutting method of the wire separation net for cutting.

Description

technical field [0001] The invention relates to the field of silicon chip cutting, in particular to a branching net for cutting and a method for cutting silicon chips. Background technique [0002] With the continuous improvement of gold cutting wire cutting technology, the diameter of gold steel wire is gradually reduced from 80 microns to 70 microns to 60 microns. It is reflected in the obvious upward trend of disconnection in pay-off and take-up. [0003] figure 1 It shows a schematic diagram of cutting a silicon block with a wire mesh for traditional cutting. The first cutting wire and the last cutting wire at the end of the gold cutting wire slicing wire mesh 400 are connected to the pay-off wheel 410 and the take-up wheel 420. During the cutting process, the tension of the steel wire fluctuates and the edge of the wire mesh is unstable to the coolant. Cause the groove profile of guide wheel to wear and tear seriously, easily cause the disconnection of take-up and re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04B28D5/00
CPCB28D5/0058B28D5/045
Inventor 白瑞强
Owner 阜宁协鑫光伏科技有限公司