Supporting device used for heat treatment process

Abstract

The invention discloses a supporting device used for a heat treatment process. The supporting device comprises supports and sleeve ring assemblies, wherein multiple protruding supporting points are formed in the surface of the tops of the supports, each sleeve ring assembly comprises a rotary shelf which is rotatably connected to one pivot formed in the corresponding support, a first swing part which extends from one side of the rotary shelf and is used for sensing the contact condition of a supported element and the corresponding support, and a second swing part which extends from the other side of the rotary shelf and is in linkage with the first swing part. The supported element touches the corresponding first swing part to rotate in a plane perpendicular to the extension direction of the corresponding support with the pivot being the axis, each first swing part is in linkage with the second swing part to make the second swing part swing through the rotary shelf, and is used for stirring the supported element to a predetermined position of the support. According to the supporting device used for heat treatment process, the situation that abnormity of part pick-up is caused when the supported element is deviated in the heat treatment process is avoided, and the equipment error alarming rate is lowered; the supporting device is simple in structure, and easy to assemble and maintain, and the cost of the device is easy to control.

Description

technical field [0001] The invention relates to the field of display panel manufacturing, in particular to a support device for heat treatment process. Background technique [0002] In the prior art, most of the heat treatment process in the TFT-LCD industry adopts a fixed heat treatment process support. Due to the unreasonable structural design of the fixed heat treatment process support, there are the following technical defects in a high temperature environment: [0003] 1. During the heat treatment process, the supported component is prone to slight deviation due to the vibration of the equipment or heating by blowing hot air. Once the supported component is displaced, it will lead to abnormal chip picking when the process is completed, or it will be damaged due to over-baking. The supporting element is scrapped. [0004] 2. The structure is cumbersome, which is not conducive to repair, maintenance and cost control. Contents of the invention [0005] The technical pr...

AI Technical Summary

Problems solved by technology

[0003] 1. During the heat treatment process, the supported component is prone to slight deviation due to the vibration of the equipment or heating by blowing hot air. Once the supported component is displaced, it will lead to abnormal chip picking when the process is completed, or it will be damaged due to over-baking. Support element scrapped

[0004] 2. The structure is cumbersome, which is not conducive to repair, maintenance and cost control

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