Camera shooting module and molded photosensitive assembly thereof as well as manufacturing method for molded photosensitive assembly and electronic equipment

Abstract

The invention provides a camera shooting module and a molded photosensitive assembly thereof as well as a manufacturing method for the molded photosensitive assembly and electronic equipment. The molded photosensitive assembly of the camera shooting module comprises at least one supporting element, at least one photosensitive element, at least one circuit board, at least one group of leads and atleast one molded base. Both ends of each group of the leads are respectively connected to a non-photosensitive region of each photosensitive element and each circuit board, each molded base comprisesa molded body and an optical window, wherein a molding process is performed by a forming mold, so that when the molded body is formed, each supporting element is used for preventing the inner surfaceof the forming mold from pressing the lead, wherein a photosensitive region of the photosensitive element corresponds to the optical window.

Description

technical field [0001] The invention relates to the field of optical imaging, in particular to a camera module and its molded photosensitive component, manufacturing method and electronic equipment. Background technique [0002] In recent years, camera modules used to acquire images have become more and more widely used in personal electronics, automotive, and medical fields. For example, camera modules have become the standard for portable electronic devices such as smartphones and tablet computers. One of the accessories. A camera module applied to a portable electronic device can not only acquire images, but also help the portable electronic device realize functions such as instant video calls. With the development trend of portable electronic devices becoming thinner and lighter and users' requirements for imaging quality of camera modules are getting higher and higher, more stringent requirements are put forward for the overall size of the camera module and the imaging...

AI Technical Summary

Problems solved by technology

[0005] First of all, the photosensitive element of the camera module is mounted on the circuit board and electrically connected to the photosensitive element and the circuit board through the lead wire. Usually, the two ends of the lead wire are soldered to the photosensitive element and the circuit board respectively, and are limited by the bonding process and the lead wire. Its own properties, after the two ends of the lead are welded to the photosensitive element and the wire plate, it is curved upward and protrudes from the upper surface of the photosensitive element. During the molding process of the camera module, the pressing of the upper mold of the forming mold The surface will be in contact with the protruding part of the lead wire, causing the lead wire to be deformed under pressure, and once the lead wire is deformed, it is difficult for the lead wire to return to its original state after the upper mold of the molding die is removed

Secondly, when the molding material used to form the stent is added to the molding space of the molding die and solidified in the molding space to form the stent, the deformed lead is wrapped inside the stent to maintain the deformed state, while the deformed lead The ability to transmit electrical signals between the photosensitive element and the circuit board will be greatly reduced, so that it will have a relatively large impact on the imaging capability and imaging efficiency of the camera module

More importantly, when the leads are deformed due to the extrusion of the pressing surface of the upper mold, the deformation direction and degree of deformation of the leads are uncontrollable. Therefore, adjacent leads may contact each other after deformation. Causes a short circuit, which in turn leads to an increase in the defective rate of the camera module

In addition, after the photosensitive element is mounted on the circuit board, there will be a gap between the photosensitive element and the circuit board. During the molding process, the fluid molding material will enter the gap formed between the photosensitive element and the circuit board. As a result, the attachment relationship between the photosensitive element and the circuit board is changed, and once the attachment relationship between the photosensitive element and the circuit board is changed, it will inevitably cause the tilt of the photosensitive element, which affects the imaging quality of the camera module.

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