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Electromagnetic shielding packaging method of point pre-fixed thin film circuit

A thin-film circuit and electromagnetic shielding technology, which is applied in the direction of circuit devices, circuits, printed circuits, etc., can solve problems such as difficult to avoid circuit electromagnetic interference, inconvenient metal cavity processing, etc.

Active Publication Date: 2019-11-12
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the fields of high frequency and communication, due to the limitation of cavity volume, it is inconvenient to process large-area metal cavity, and it is difficult to avoid electromagnetic interference between circuits.

Method used

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  • Electromagnetic shielding packaging method of point pre-fixed thin film circuit
  • Electromagnetic shielding packaging method of point pre-fixed thin film circuit
  • Electromagnetic shielding packaging method of point pre-fixed thin film circuit

Examples

Experimental program
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Effect test

Embodiment approach

[0020] An electromagnetic shielding packaging method for point pre-fixed film circuits, comprising:

[0021] Step (a) obtaining a thin film circuit substrate provided with a fixing plate;

[0022] Step (b) making a metal cavity provided with connecting pieces matching the size of the thin film circuit substrate;

[0023] Step (c) pre-fixing the thin film circuit substrate and the metal cavity.

[0024] Further, the front side surface of the thin film circuit substrate is covered with a metal film. The front and side of the thin film circuit substrate are covered with a metal film, which can effectively guarantee the metal interconnection effect on the side of the circuit.

[0025] Further, the method for obtaining a thin film circuit substrate provided with a fixing plate includes:

[0026] Step (a-1) opening an array through cavity shorter than the length of the circuit along the circuit array in the circuit substrate;

[0027] Step (a-2) plating a metal film on the surfa...

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Abstract

The invention discloses an electromagnetic shielding package method of a point pre-fixed thin film circuit. The electromagnetic shielding package method comprises the steps of (a) obtaining a thin film circuit substrate with a fixed plate; (b) fabricating a metal cavity which is matched with the size of the thin film circuit substrate and is provided with a connection piece; and (c) pre-fixing thethin film circuit substrate and the metal cavity. By point pre-fixing of the fixed plate of the thin film circuit substrate and the connection piece of the metal cavity, the thin film circuit substrate can be rapidly and accurately fixed in the metal cavity to form an electromagnetic shielding structure, and the electromagnetic shielding package method is simple to operate and is low in cost.

Description

technical field [0001] The invention relates to circuit packaging, especially circuit electromagnetic shielding packaging. Background technique [0002] Traditional thin-film circuits are usually put into components in the form of "bare chips", and the interconnection between circuits is realized through the method of drawing out welding wires and ribbons. Electromagnetic isolation between circuits is generally achieved by processing metal cavities on the housing. In the fields of high frequency and communication, due to the limitation of cavity volume, it is inconvenient to process large-area metal cavity, and it is difficult to avoid electromagnetic interference between circuits. To achieve good electromagnetic compatibility between circuits, ceramic thin film circuits are required to have electromagnetic shielding capabilities. The electromagnetic shielding packaging of ceramic thin film circuits can greatly improve the electromagnetic compatibility and product stabilit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/34H01L23/552
CPCH01L23/552H05K1/0216H05K3/34H05K2201/0707
Inventor 王春富李彦睿潘玉华王文博秦跃利高阳
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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