Adjustable beam femtosecond laser processing device

Abstract

The invention discloses a beam-adjustable femtosecond laser machining device, and belongs to the technical field of laser machining device. By adoption of the beam-adjustable femtosecond laser machining device, the area of a tube machining zone for intravascular stents can be controlled easily, the stability is good, the precision is high, energy is saved, and consumption is reduced. The beam-adjustable femtosecond laser machining device comprises an ultrafast laser device, an ultrafast laser isolator, a magnification-adjustable beam expander, a reflector, a focusing lens, protective glass, alaser cutting nozzle, a workbench, an optical filter, a CCD camera and a control unit. Laser light output by the ultrafast laser device sequentially passes through the ultrafast laser isolator, the magnification-adjustable beam expander, the reflector, the focusing lens, the protective glass and the laser cutting nozzle and then is irradiated on the working area of the workbench. The CCD camera and the control end of the beam expander are connected with the control unit. A lens of the CCD camera faces the working area of the workbench. The optical filter is arranged between the reflector and the CCD camera.

Description

technical field [0001] The invention relates to the technical field of laser processing devices, in particular to a femtosecond laser processing device with an adjustable beam. Background technique [0002] Millions of vascular stents are implanted worldwide each year to treat various vascular and intravascular diseases caused by narrowing or blockage of blood vessels. Lasers play a key role in the manufacture of implantable medical devices. Through their precise control, lasers efficiently process materials into the complex and precise geometries required for these implantable medical devices. [0003] Early vascular stents were made of stainless steel and were relatively large, with component geometry and feature tolerances of ±25 μm or greater. Laser cutting, using pulsed infrared lasers with nanosecond duration, easily meets the processing accuracy requirements at this level. However, the thermal interaction of nanosecond laser pulses with the material often results i...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem that the existing laser processing device is not easy to control the size of the tube processing area of ​​the vascular stent, and to provide a device that is easy to control the size of the tube processing area of ​​the vascular stent, has good stability, high precision, and can save energy and reduce consumption. Modulated beam femtosecond laser processing device

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