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Chip package structure

A technology of chip packaging structure and chip structure, applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., can solve the problems of reduced component size and difficult implementation of manufacturing processes.

Active Publication Date: 2018-06-05
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as feature sizes continue to shrink, manufacturing processes continue to become more difficult to implement
Therefore, it is a challenge to form reliable semiconductor devices of smaller and smaller sizes

Method used

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  • Chip package structure
  • Chip package structure
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Embodiment Construction

[0068] It should be understood that the following disclosure provides many different embodiments or examples to implement different components of the provided body. The following describes specific examples of each component and its arrangement in order to simplify the description of the disclosure. Of course, these are only examples and are not intended to limit the present invention. For example, the following disclosure describes that a first part is formed on or above a second part, which means that it includes an embodiment in which the formed first part and the second part are in direct contact, and also includes It is still possible to form an additional component between the first component and the second component, and the first component and the second component may not be in direct contact. In addition, different examples in the disclosure may use repeated reference symbols and / or words. These repeated symbols or words are for the purpose of simplification and clar...

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Abstract

A chip package structure is provided. The chip package structure includes a chip structure. The chip package structure includes a first ground bump below the chip structure. The chip package structureincludes a conductive shielding film disposed over the chip structure and extending onto the first ground bump. The conductive shielding film is electrically connected to the first ground bump.

Description

Technical field [0001] The embodiments of the present invention relate to semiconductor technology, and in particular to semiconductor chip packaging structures. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced several generations of integrated circuits, each with smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits. [0003] In the history of the development of integrated circuits, the functional density (that is, the number of interconnected devices per chip area) has increased, while the geometric size (that is, the smallest component (or circuit) produced during the manufacturing process) has shrunk. The process of reducing the size of the device generally has the benefits of increasing production efficiency and reducing ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/31H01L21/50
CPCH01L21/50H01L23/3114H01L23/488H01L24/10H01L2224/1012H01L21/561H01L21/568H01L2924/181H01L2224/18H01L2224/32145H01L2224/48091H01L2224/48227H01L2224/73265H01L25/50H01L2225/06568H01L23/49805H01L21/486H01L23/5389H01L23/552H01L25/105H01L23/3128H01L23/49827H01L25/0657H01L2225/0651H01L2225/06548H01L2224/48235H01L24/19H01L24/20H01L2924/00014H01L2924/00012H01L2924/00H01L2924/0001H01L21/78H01L23/49822H01L23/562H01L23/60
Inventor 余振华蔡柏豪林俊成苏安治
Owner TAIWAN SEMICON MFG CO LTD