Card substrate lamination device
A substrate layer, card technology, applied in lamination devices, lamination, cards, etc., can solve the problem of low energy efficiency in card lamination operations
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[0019] Embodiments of the present invention are described more fully hereinafter with reference to the accompanying drawings. Various embodiments of the invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Elements identified using the same or similar reference numerals refer to the same or similar elements.
[0020] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural as well, unless the context clearly dictates otherwise. It will be further understood that the terms "comprising" and / or "comprising" when used herein specify the presence of specified feature...
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