A microled chip transfer printing method and device

A chip and transfer head technology, which is applied in the field of MicroLED chip transfer method and device, can solve the problems of enhanced adhesion of MicroLED chips in the transfer head and inability to release MicroLED chips, and achieve the effect of overcoming the difficulty of separation and realizing separation

Active Publication Date: 2020-08-04
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the MicroLED chip will be heated and soldered after being transported to the target substrate to complete the alignment. At this time, the transfer head will be heated and softened, which will strengthen the adhesion of the MicroLED chip, resulting in the inability of the MicroLED chip to be released to the target substrate. This problem has been resolved. Become an industry problem

Method used

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  • A microled chip transfer printing method and device
  • A microled chip transfer printing method and device
  • A microled chip transfer printing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] see figure 1 with 4 , a MicroLED chip transfer method, applied to the production of MicroLED displays, comprising the following steps:

[0033] The transfer head 10 is provided with a protrusion 11, and the transfer head 10 sticks the thermoplastic silica gel block 30 to the lower surface of the protrusion 11;

[0034] The transfer head 10 sticks the Micro LED chip 40 on the lower surface of the thermoplastic silicone block 30;

[0035] The transfer head 10 transports the Micro LED chip 40 to the target position of the driving substrate 22;

[0036] heating the driving substrate 22 to a first temperature, and welding the MicroLED chip 40 and the driving substrate 22;

[0037] Continue heating the drive substrate 22 to the second temperature, the thermoplastic silica gel block 30 melts and separates from the transfer head 10 under the action of gravity;

[0038] The transfer head 10 moves vertically upwards, drives the substrate 22 to cool down, and completes the tra...

Embodiment 2

[0062] see figure 2 with 4 , a MicroLED chip transfer method, applied to the production of MicroLED displays, comprising the following steps:

[0063] The transfer head 10 adheres the thermoplastic silica gel block 30 to the lower surface;

[0064] The transfer head 10 further sticks the Micro LED chip 40 on the lower surface of the thermoplastic silicone block 30;

[0065] The transfer head 10 transports the Micro LED chip 40 to the target position of the driving substrate 22;

[0066] heating the driving substrate 22 to a first temperature, and welding the MicroLED chip 40 and the driving substrate 22;

[0067] Continue heating the drive substrate 22 to the second temperature, the thermoplastic silica gel block 30 melts and separates from the transfer head 10 under the action of gravity;

[0068] The transfer head 10 moves vertically upwards, drives the substrate 22 to cool down, and completes the transfer of the Micro LED chip 40 .

[0069] The transfer head 10 sticks...

Embodiment 3

[0092] see image 3 with 4 , a MicroLED chip transfer method, applied to the production of MicroLED displays, comprising the following steps:

[0093] The transfer head 10 is provided with a protrusion 11, and the transfer head 10 sticks the thermoplastic silica gel block 30 to the lower surface of the protrusion 11;

[0094] The transfer head 10 sticks the Micro LED chip 40 on the lower surface of the thermoplastic silicone block 30;

[0095] The transfer head 10 transports the Micro LED chip 40 to the target position of the driving substrate 22;

[0096] heating the driving substrate 22 to a first temperature, and welding the MicroLED chip 40 and the driving substrate 22;

[0097] Continue heating the drive substrate 22 to the second temperature, the thermoplastic silica gel block 30 melts and separates from the transfer head 10 under the action of gravity;

[0098] The transfer head 10 moves vertically upwards, drives the substrate 22 to cool down, and completes the tra...

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Abstract

A MicroLED chip transfer printing method and device, relating to a chip transfer printing method. The transfer head sticks the thermoplastic silicone block to the lower surface of the protrusion of the transfer head; the transfer head sticks the MicroLED chip on the lower surface of the thermoplastic silicone block; the transfer head transports the chip to the target position of the drive substrate; heats the drive substrate to the first Temperature, solder the chip to the drive substrate; continue to heat the drive substrate to the second temperature, melt the thermoplastic silica gel block and separate the transfer head; the transfer head moves vertically upwards, drives the substrate to cool down, and completes the chip transfer. Applied to the production of Micro LED displays, by using thermoplastic silica gel as the connection unit between the chip and the transfer head, the thermoplastic silica gel is heated and melted during the heating process, and is automatically separated from the transfer head to realize the separation of the chip and the transfer fixture, overcoming The problem that the chip is difficult to separate from the transfer head after being heated.

Description

technical field [0001] The present invention relates to a chip transfer printing method, in particular to a Micro LED chip transfer printing method and device. Background technique [0002] Micro LED display technology has the advantages of low power consumption, high brightness, ultra-high resolution and color saturation, fast response, ultra-power saving, long life, and high efficiency. It is considered to be the most competitive next-generation display technology. Its power consumption is about 10% of LCD and 50% of OLED. Compared with OLED, which is also a self-luminous display, the brightness is 30 times higher than it, and the resolution can reach more than 1500PPI (pixel density), and the resolution is 5 times higher than OLED. Micro LED can not only reduce the cost of mass production, but also improve the overall resolution, which is expected to replace the current display technologies such as OLED and LCD. [0003] Micro LED technology, in simple terms, is to use ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L21/683H01L33/48
CPCH01L21/6835H01L33/48H01L2221/68363H01L2933/0033
Inventor陈忠郭伟杰吕毅军林岳吴挺竹高玉琳郭自泉朱丽虹
OwnerXIAMEN UNIV