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Semiconductor package

一种封装结构、半导体的技术，应用在半导体器件、半导体/固态器件零部件、电固体器件等方向，能够解决RF性能衰减等问题

Active Publication Date: 2018-07-31
MEDIATEK INC
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, the above-mentioned problems will lead to RF performance degradation

Method used

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  • Semiconductor package
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Embodiment Construction

[0031] Certain terms are used in the description and claims of this application to refer to particular elements. Those skilled in the art should understand that hardware manufacturers may use different terms to refer to the same component. The specification and claims do not use the difference in name as a way to distinguish components, but use the difference in function of components as a criterion for distinguishing. "Include" and "comprising" mentioned throughout the specification and claims are open-ended terms, so they should be interpreted as "including (including) but not limited to". In addition, the term "coupled" herein includes any direct and indirect electrical connection means. Therefore, if it is described that a first device is coupled to a second device, it means that the first device may be directly electrically connected to the second device, or indirectly electrically connected to the second device through other devices or connection means.

[0032] The fo...

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Abstract

A semiconductor package structure is provided in the embodiment of the invention. The semiconductor package structure includes a package substrate; an integrated circuit (IC) die having a radio frequency (RF) circuit and a memory die stacked over the package substrate. The memory die entirely covers a first surface portion of the package substrate to define a second surface portion of the packagesubstrate exposed from the memory die, and the IC die partially covers the first surface portion and the second surface portion of the package substrate. The RF circuit includes a first sensitive device region corresponding to the second surface portion of the package substrate and a second sensitive device region corresponding to the first surface portion of the package substrate and offsetting amemory input / output (I / O) electrical path of the memory die, as viewed from a top-view perspective. The semiconductor package structure can guarantee or maintain the performance of the RF circuit.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to a semiconductor packaging structure. Background technique [0002] In recent years, as electronic products become more and more multifunctional and smaller in size, the industry expects manufacturers of semiconductor devices to form more components in a single semiconductor package, so that electronic products using these components can be achieved in terms of cost, size, Offers various advantages in terms of performance and product design flexibility. [0003] In response to this expectation, stacked-die packaging technology has been developed. Stacked die packaging technology enables two or more dies with different functions to be mounted on each other, ie stacked. Stacked die packaging technology allows higher device density in electronic products such as mobile phones, personal digital assistants (PDAs), and digital cameras. [0004] These electronic products additiona...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16
CPCH01L25/16H01L2225/06527H01L2225/06537H01L23/552H01L25/18H01L2225/06562H01L2225/06572H01L23/66H01L25/0657H01L23/645H01L2223/6605
Inventor 林圣谋许志骏吴文洲
Owner MEDIATEK INC
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