Flexible display and manufacturing method thereof, and electronic equipment
A flexible display and flexible display technology, which is applied in semiconductor/solid-state device manufacturing, circuits, photovoltaic power generation, etc., can solve problems such as poor function of flexible screens and broken signal lines, so as to reduce the attachment process and prevent signal lines from breaking , the effect of increasing strength
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no. 1 example
[0034] Such as figure 1 As shown, the first embodiment of the present invention provides a flexible display, which includes a flexible display, a driver chip 131 and a support device 13;
[0035] Please combine figure 2 It can be understood that the flexible display screen includes a flexible substrate 12, one side of the flexible substrate 12 includes a display area 122 and a binding area 121, and the other side of the flexible substrate 12 is provided with a strip that can be peeled off from the flexible substrate 12. carrier substrate 11;
[0036] In this embodiment, the material of the flexible substrate 12 may be PI (Polyimide, polyimide) material, or any other flexible transparent film material, which is not limited in this embodiment.
[0037] In this embodiment, the carrier substrate 11 may be a rigid carrier such as a silicon wafer, metal, or glass.
[0038] The driver chip 131 is bound to the binding area 121; the supporting device 13 covers the flexible substrat...
no. 2 example
[0049] Such as Figure 4As shown, the second embodiment of the present invention provides a method for manufacturing a flexible display, and for the flexible display, reference may be made to the content described in the first embodiment.
[0050] The method comprises the steps of:
[0051] 21. Set one end of the flexible substrate of the flexible display as a binding area, and set the other end as a display area;
[0052] 22. Cover the flexible substrate with a supporting device, and set an opening in the supporting device at the position of the binding area;
[0053] 23. Bind the driver chip on the binding area.
[0054] please refer again Figure 4 As shown, further, after the binding of the driver chip in the binding area, it also includes the steps of:
[0055] 24. Peel off the carrier substrate combined with the flexible substrate.
[0056] Specifically, a laser is used to lift off the carrier substrate combined with the flexible substrate.
[0057] The manufacturi...
no. 3 example
[0060] refer to Figure 5 , Figure 5 An electronic device is provided for the third embodiment of the present invention. The electronic device 30 includes the flexible display provided by any of the foregoing embodiments, and may be any flexible, curved, planar, rollable, or foldable flexible display. Including but not limited to the following types of electronic devices: rollable or foldable mobile phones, watches, bracelets, TVs or other wearable display or touch electronic devices, as well as flexible smartphones, tablets, laptops, desks Upper-type displays, TV sets, smart glasses, smart watches, ATM machines, digital cameras, car displays, medical displays, industrial control displays, electronic paper books, electrophoretic display devices, game consoles, transparent displays, double-sided displays, naked-eye 3D displays, Mirror display devices, transflective display devices, etc.
[0061] In the electronic device provided by the embodiment of the present invention, b...
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