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Display panel manufacturing method, display panel and printing device

A technology for display panels and pad printing devices, which can be applied to optics, instruments, electrical components, etc., and can solve the problems that pad printing solutions cannot be applied to high-resolution products

Active Publication Date: 2018-08-24
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a method for manufacturing a display panel, a display panel and a pad printing device, which are used to at least partially solve the problem that the existing pad printing scheme for connecting lines in the binding area cannot be applied to high Problems with resolution products

Method used

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  • Display panel manufacturing method, display panel and printing device
  • Display panel manufacturing method, display panel and printing device
  • Display panel manufacturing method, display panel and printing device

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Embodiment Construction

[0033] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] The invention provides a method for manufacturing a display panel, such as image 3 As shown, the display panel includes a base substrate 1 , the first surface 11 of the base substrate 1 includes a peripheral area 12 , and a plurality of first connection lines 13 are arranged on one side of the peripheral area 12 . The side of the base substrate 1 where the first connection line 13 is located is the side to be bound of the display panel, the first connection line 13 is the connectio...

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PUM

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Abstract

The invention provides a display panel manufacturing method, a display panel and a printing device. A metal solution is formed on a side surface of a base substrate to form a first region to be bonded, after solidification, a second connecting line which is corresponding to and connected to a first connecting line at the front side of the substrate is formed by etching, thus the side binding of the display panel is achieved. The scheme of the invention can be applied to a liquid crystal display panel and an OLED panel, the widths and spacing of the connecting lines in an area to be bound can be reduced through applying a mode of overall printing and etching, thus the scheme can be applied to a full-size display panel, the application range is wider, and the scheme is especially suitable for a high-resolution product.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for manufacturing a display panel, a display panel and a pad printing device. Background technique [0002] With the development of display technology, narrow borders have become the development trend of display panels. At present, the border of the display panel on the non-bonding (binding) side can reach 0.9mm, but due to the existence of the bonding area, the border on the bonding side Still wider. [0003] For liquid crystal display panels, at present, the prepared connection lines can be printed on the side of the substrate by pad printing to realize side bonding. Specifically, the area corresponding to the connection lines is formed in the oil cup of the pad printing device Each region contains a liquid metal solution, and the pad printing head is used to dip the liquid metal solution in each region to form a connection line on the side of the substrate. In this...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/32G02F1/1345H10K99/00
CPCG02F1/13452H10K59/131H10K71/40H10K71/162H10K71/60H10K71/00
Inventor 张玉军
Owner BOE TECH GRP CO LTD