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A method for manufacturing a display panel, a display panel, and a pad printing device

A technology for a display panel and a manufacturing method, which is applied in the directions of instruments, semiconductor devices, electrical components, etc., can solve the problem that the pad printing solution cannot be applied to high-resolution products.

Active Publication Date: 2021-03-16
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a method for manufacturing a display panel, a display panel and a pad printing device, which are used to at least partially solve the problem that the existing pad printing scheme for connecting lines in the binding area cannot be applied to high Problems with resolution products

Method used

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  • A method for manufacturing a display panel, a display panel, and a pad printing device
  • A method for manufacturing a display panel, a display panel, and a pad printing device
  • A method for manufacturing a display panel, a display panel, and a pad printing device

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Embodiment Construction

[0034] Next, the technical solutions in the present invention will be described in conjunction with the drawings in the present invention, and it is apparent that the described embodiments are intended, and embodiments of the invention are in FIG. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative labor are the scope of the present invention.

[0035] The present invention provides a method of making a display panel, such as image 3 As shown, the display panel includes a substrate substrate 1, and a first surface 11 of the substrate substrate 1 comprises a peripheral region 12, a plurality of first connecting wires 13 are provided on one side of the peripheral region 12. On the side of the first connecting wire 13 on the substrate substrate 1 is to be bracing on the display panel, the first connecting wire 13 is a connection line of the binding area, and the first surface 11 is the front ...

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Abstract

The invention provides a method for manufacturing a display panel, a display panel and a pad printing device. A metal solution is formed on the side of a base substrate to form a first region to be bound. The first connecting line is corresponding to and connected with the second connecting line, so as to realize the side binding of the display panel. The solution of the present invention can be applied to the liquid crystal display panel and the OLED panel; The line width and spacing of the connecting lines in the area to be bound can be applied to a full-size display panel, and the application range is wider, especially for high-resolution products.

Description

Technical field [0001] The present invention relates to the field of display, and more particularly to a method of fabricating a display panel, a display panel, and a transfer device. Background technique [0002] With the development of display technology, the narrow border has become the development trend of the display panel. At present, the display panel can be 0.9mm on the border of the non-Bonding side, but due to the presence of the Bonding area, the border on the Bonding side Still wider. [0003] For the liquid crystal display panel, it is currently movable to the side surface of the substrate substrate, and the side Bonding, specifically, in the oil cup of the transfer device forms a region corresponding to the cable. The liquid metal solution is accommodated in each region, and the liquid metal solution in each region is separately applied to the side surface of the substrate substrate, respectively. In this process, since the spacing of adjacent cables is small, and a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32G02F1/1345H10K99/00
CPCG02F1/13452H10K59/131H10K71/40H10K71/162H10K71/60H10K71/00
Inventor 张玉军
Owner BOE TECH GRP CO LTD